Inventor · disambiguated record
Hiromi Egawa
Also filed as: EGAWA HIROMI
3 granted patents·1 pending application·84 citations·filing 1987–2008
74Inventor score
Top patents by PatentIndex Score
4 records- 0193US7399715B2Organic silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor deviceJSR CORP·Filed 2005·Granted Jul 15, 2008·30 cites·13 claims
- 0287US4818806AProcess for producing highly adherent silicon-containing polyamic acid and corsslinked silicon-containing polyimideCHISSO CORP·Filed 1987·Granted Apr 4, 1989·45 cites·7 claims
- 0383US7932295B2Organic silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor deviceJSR CORP·Filed 2008·Granted Apr 26, 2011·9 cites·30 claims
- 0435US2006223001A1Radiation-sensitive resin compositionNISHIMURA ISAO·Filed 2006·Application pending·0 cites
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