Inventor · disambiguated record
Tongbi Jiang
Also filed as: JIANG TONGBI · JIANG TONGBI T · JIANG TONGBI TOM
313 granted patents·40 pending applications·7,261 citations·filing 1996–2025
99Inventor score
Top patents by PatentIndex Score
353 records- 0199US7781877B2Packaged integrated circuit devices with through-body conductive vias, and methods of making sameMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 24, 2010·113 cites·21 claims
- 0299US7749882B2Packaged microelectronic devices and methods for manufacturing packaged microelectronic devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 6, 2010·126 cites·16 claims
- 0399US6048755AMethod for fabricating BGA package using substrate with patterned solder mask open in die attach areaMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 11, 2000·473 cites·20 claims
- 0498US7573136B2Semiconductor device assemblies and packages including multiple semiconductor device componentsMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 11, 2009·128 cites·9 claims
- 0598US7198980B2Methods for assembling multiple semiconductor devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 3, 2007·230 cites·22 claims
- 0698US6906415B2Semiconductor device assemblies and packages including multiple semiconductor devices and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 14, 2005·203 cites·55 claims
- 0798US6343019B1Apparatus and method of stacking die on a substrateMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 29, 2002·220 cites·27 claims
- 0897US9661411B1Integrated MEMS microphone and vibration sensorAPPLE INC·Filed 2016·Granted May 23, 2017·62 cites·20 claims
- 0997US8723307B2Packaged integrated circuit devices with through-body conductive vias, and methods of making sameJIANG TONGBI·Filed 2010·Granted May 13, 2014·37 cites·22 claims
- 1097US7910385B2Method of fabricating microelectronic devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Mar 22, 2011·54 cites·17 claims
- 1197US6616864B1Z-axis electrical contact for microelectronic devicesMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 9, 2003·107 cites·5 claims
- 1297US6579744B1Electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesiveMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 17, 2003·83 cites·35 claims
- 1397US6548376B2Methods of thinning microelectronic workpiecesMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 15, 2003·146 cites·34 claims
- 1497US6515355B1Passivation layer for packaged integrated circuitsMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 4, 2003·191 cites·14 claims
- 1597US6316285B1Passivation layer for packaged integrated circuitsMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 13, 2001·216 cites·18 claims
- 1697US6184064B1Semiconductor die back side surface and method of fabricationMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 6, 2001·157 cites·37 claims
- 1797US5879965APlastic lead frames for semiconductor devices, packages including same, and methods of fabricationMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 9, 1999·173 cites·24 claims
- 1896US6208519B1Thermally enhanced semiconductor packageMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 27, 2001·176 cites·36 claims
- 1995US9735539B2VCSEL structure with embedded heat sinkAPPLE INC·Filed 2016·Granted Aug 15, 2017·8 cites·18 claims
- 2095US6576495B1Microelectronic assembly with pre-disposed fill material and associated method of manufactureMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·105 cites·42 claims
- 2194US11422104B2Exposed wire-bonding for sensing liquid and water in electronic devicesAPPLE INC·Filed 2020·Granted Aug 23, 2022·4 cites·15 claims
- 2294US8092734B2Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagersJIANG TONGBI·Filed 2004·Granted Jan 10, 2012·95 cites·55 claims
- 2394US7115853B2Micro-lens configuration for small lens focusing in digital imaging devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Oct 3, 2006·67 cites·25 claims
- 2494US7109063B2Semiconductor substrate for build-up packagesMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 19, 2006·67 cites·42 claims
- 2594US6239489B1Reinforcement of lead bonding in microelectronics packagesMICRON TECHNOLOGY INC·Filed 1999·Granted May 29, 2001·145 cites·39 claims
- 2693US11594525B2Packaged integrated circuit devices with through-body conductive vias, and methods of making sameMICRON TECHNOLOGY INC·Filed 2022·Granted Feb 28, 2023·1 cites·27 claims
- 2793US11561144B1Wearable electronic device with fluid-based pressure sensingAPPLE INC·Filed 2019·Granted Jan 24, 2023·8 cites·20 claims
- 2893US10454241B2VCSEL structure with embedded heat sinkAPPLE INC·Filed 2018·Granted Oct 22, 2019·5 cites·20 claims
- 2993US10103512B2VCSEL structure with embedded heat sinkAPPLE INC·Filed 2017·Granted Oct 16, 2018·5 cites·12 claims
- 3093US7557337B2Micro-lens configuration for small lens focusing in digital imaging devicesAPTINA IMAGING CORP·Filed 2005·Granted Jul 7, 2009·18 cites·25 claims
- 3193US7091064B2Method and apparatus for attaching microelectronic substrates and support membersMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 15, 2006·61 cites·52 claims
- 3293US6699928B2Adhesive composition for use in packaging applicationsMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 2, 2004·72 cites·16 claims
- 3393US6610591B1Methods of ball grid arrayMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 26, 2003·49 cites·17 claims
- 3493US6048656AVoid-free underfill of surface mounted chipsMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 11, 2000·146 cites·50 claims
- 3593US6011307AAnisotropic conductive interconnect material for electronic devices, method of use and resulting productMICRON TECHNOLOGY INC·Filed 1997·Granted Jan 4, 2000·155 cites·38 claims
- 3692US7268012B2Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed therebyMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 11, 2007·49 cites·43 claims
- 3792US6949834B2Stacked semiconductor package with circuit side polymer layerMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 27, 2005·49 cites·10 claims
- 3892US6896760B1Fabrication of stacked microelectronic devicesMICRON TECHNOLOGY INC·Filed 2002·Granted May 24, 2005·51 cites·23 claims
- 3992US6661104B2Microelectronic assembly with pre-disposed fill material and associated method of manufactureMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 9, 2003·71 cites·31 claims
- 4091US7633157B2Microelectronic devices having a curved surface and methods for manufacturing the sameMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 15, 2009·26 cites·32 claims
- 4191US7592691B2High density stacked die assemblies, structures incorporated therein and methods of fabricating the assembliesMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 22, 2009·19 cites·33 claims
- 4291US7169685B2Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesiveMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 30, 2007·53 cites·74 claims
- 4391US6710456B1Composite interposer for BGA packagesMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 23, 2004·51 cites·37 claims
- 4491US6346151B1Method and apparatus for electroless plating a contact padMICRON TECHNOLOGY INC·Filed 1999·Granted Feb 12, 2002·67 cites·9 claims
- 4591US6323543B1Plastic lead frames for semiconductor devices, packages including same, and methods of fabricationMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 27, 2001·34 cites·36 claims
- 4691US6303500B1Method and apparatus for electroless plating a contact padMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 16, 2001·74 cites·23 claims
- 4791US6073497AHigh resolution pressure sensing device having an insulating flexible matrix loaded with filler particlesMICRON TECHNOLOGY INC·Filed 1997·Granted Jun 13, 2000·54 cites·31 claims
- 4890US7998860B2Method for fabricating semiconductor components using maskless back side alignment to conductive viasMICRON TECHNOLOGY INC·Filed 2009·Granted Aug 16, 2011·14 cites·19 claims
- 4990US7655500B2Packaged microelectronic devices and methods for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2008·Granted Feb 2, 2010·14 cites·22 claims
- 5090US7037756B1Stacked microelectronic devices and methods of fabricating sameMICRON TECHNOLOGY INC·Filed 2003·Granted May 2, 2006·51 cites·38 claims
Showing the top 50 of 353 patent records by PatentIndex Score.
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