Inventor · disambiguated record
Michael H. S. Dayringer
Also filed as: DAYRINGER MICHAEL · DAYRINGER MICHAEL H S
7 granted patents·3 pending applications·24 citations·filing 2018–2022
76Inventor score
Files withORACLE INT CORP10
Top patents by PatentIndex Score
10 records- 0195US11132875B1Method and apparatus for passively detecting card skimmers based on EMI fingerprintsORACLE INT CORP·Filed 2020·Granted Sep 28, 2021·5 cites·18 claims
- 0295US11055396B2Detecting unwanted components in a critical asset based on EMI fingerprints generated with a sinusoidal loadORACLE INT CORP·Filed 2019·Granted Jul 6, 2021·19 cites·20 claims
- 0374US11726160B2Automated calibration in electromagnetic scannersORACLE INT CORP·Filed 2022·Granted Aug 15, 2023·0 cites·20 claims
- 0463US11275144B2Automated calibration of EMI fingerprint scanning instrumentation for utility power system counterfeit detectionORACLE INT CORP·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 0557US2020357772A1Method and apparatus for stacking warped chips to assemble three-dimensional integrated circuitsORACLE INT CORP·Filed 2020·Application pending·0 cites
- 0653US10984106B2Using EMI fingerprints to detect malicious cryptomining softwareORACLE INT CORP·Filed 2019·Granted Apr 20, 2021·0 cites·20 claims
- 0748US11460500B2Counterfeit device detection using EMI fingerprintsORACLE INT CORP·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
- 0848US11120134B2Detecting unwanted components in a computer system based on EMI fingerprints obtained through an insertable deviceORACLE INT CORP·Filed 2019·Granted Sep 14, 2021·0 cites·17 claims
- 0948US2019279962A1Method and apparatus for stacking warped chips to assemble three-dimensional integrated circuitsORACLE INT CORP·Filed 2018·Application pending·0 cites
- 1046US2021081573A1Merged surface fast scan technique for generating a reference emi fingerprint to detect unwanted components in electronic systemsORACLE INT CORP·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →