Inventor · disambiguated record
Shao-Ta Hsu
Also filed as: HSU SHAO-TA
7 granted patents·3 pending applications·33 citations·filing 2004–2011
81Inventor score
Top patents by PatentIndex Score
10 records- 0186US7238586B2Seamless trench fill method utilizing sub-atmospheric pressure chemical vapor deposition techniqueUNITED MICROELECTRONICS CORP·Filed 2005·Granted Jul 3, 2007·16 cites·5 claims
- 0271US7494878B2Metal-oxide-semiconductor transistor and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2006·Granted Feb 24, 2009·4 cites·14 claims
- 0369US8921977B2Capacitor array and method of fabricating the sameHUANG JEN JUI·Filed 2011·Granted Dec 30, 2014·4 cites·13 claims
- 0468US7642166B2Method of forming metal-oxide-semiconductor transistorsUNITED MICROELECTRONICS CORP·Filed 2008·Granted Jan 5, 2010·3 cites·20 claims
- 0566US7541298B2STI of a semiconductor device and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jun 2, 2009·2 cites·21 claims
- 0648US7205634B2MIM structure and fabrication process with improved capacitance reliabilityTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 17, 2007·4 cites·32 claims
- 0748US2008188091A1Semiconductor device, method for fabricating thereof and method for increasing film stressHSU SHAO-TA·Filed 2008·Application pending·0 cites
- 0847US2008185655A1Smiconductor device, method for fabricating thereof and method for increasing film stressUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 0938US7294572B2Method of forming contactUNITED MICROELECTRONICS CORP·Filed 2005·Granted Nov 13, 2007·0 cites·16 claims
- 1037US2005253268A1Method and structure for improving adhesion between intermetal dielectric layer and cap layerHSU SHAO-TA·Filed 2004·Application pending·0 cites
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