Inventor · disambiguated record

Giovanni Capuz

Also filed as: CAPUZ GIOVANNI

2 granted patents·0 citations·filing 2017–2020

21Inventor score

Technology areasH10W

Files withIMEC VZW2

Top patents by PatentIndex Score

2 records

0142US11362061B2Method for the electrical bonding of semiconductor componentsIMEC VZW·Filed 2020·Granted Jun 14, 2022·0 cites·22 claims
0232US10797016B2Method for bonding semiconductor chips to a landing waferIMEC VZW·Filed 2017·Granted Oct 6, 2020·0 cites·11 claims

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