Inventor · disambiguated record
Jaber Derakhshandeh
Also filed as: DERAKHSHANDEH JABER
4 granted patents·7 pending applications·13 citations·filing 2015–2025
61Inventor score
Technology areasH10W
Files withIMEC VZW11
Top patents by PatentIndex Score
11 records- 0190US9978710B2Method for self-aligned solder reflow bonding and devices obtained thereofIMEC VZW·Filed 2016·Granted May 22, 2018·13 cites·10 claims
- 0260US2025118691A1Semiconductor Component Comprising Structured Contacts and A Method for Producing the ComponentIMEC VZW·Filed 2024·Application pending·0 cites
- 0356US2025098549A1Fabrication of Through-Silicon ViasIMEC VZW·Filed 2023·Application pending·0 cites
- 0456US2024203965A1Method for bonding and interconnecting micro-electronic componentsIMEC VZW·Filed 2023·Application pending·0 cites
- 0553US2025349763A1Methods of producing a receiving substrate for bonding semiconductor dies theretoIMEC VZW·Filed 2025·Application pending·0 cites
- 0653US2025349557A1Methods of producing a receiving substrate for bonding semiconductor dies theretoIMEC VZW·Filed 2025·Application pending·0 cites
- 0750US2024297136A1Method for producing solder bumps on a superconducting qubit substrateIMEC VZW·Filed 2024·Application pending·0 cites
- 0850US2023200263A1Quantum Bit Chip and Method for Fabricating Quantum Bit ChipIMEC VZW·Filed 2022·Application pending·0 cites
- 0947US11810892B2Method of direct bonding semiconductor componentsIMEC VZW·Filed 2020·Granted Nov 7, 2023·0 cites·8 claims
- 1042US11362061B2Method for the electrical bonding of semiconductor componentsIMEC VZW·Filed 2020·Granted Jun 14, 2022·0 cites·22 claims
- 1138US10066303B2Thin NiB or CoB capping layer for non-noble metallic bonding landing padsIMEC VZW·Filed 2015·Granted Sep 4, 2018·0 cites·15 claims
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