Inventor · disambiguated record
Roy Dittler
Also filed as: DITTLER ROY
6 granted patents·1 pending application·3 citations·filing 2015–2021
68Inventor score
Files withINTEL CORP7
Top patents by PatentIndex Score
7 records- 0175US11791228B2Method for forming embedded grounding planes on interconnect layersINTEL CORP·Filed 2019·Granted Oct 17, 2023·2 cites·17 claims
- 0260US10798817B2Method for making a flexible wearable circuitINTEL CORP·Filed 2015·Granted Oct 6, 2020·1 cites·19 claims
- 0349US12159844B2Electronic substrates having embedded inductorsINTEL CORP·Filed 2020·Granted Dec 3, 2024·0 cites·20 claims
- 0447US12416093B2Electroless plating processINTEL CORP·Filed 2021·Granted Sep 16, 2025·0 cites·13 claims
- 0543US11501967B2Selective metal deposition by patterning direct electroless metal platingINTEL CORP·Filed 2019·Granted Nov 15, 2022·0 cites·12 claims
- 0641US11291122B2Apparatus with a substrate provided with plasma treatmentINTEL CORP·Filed 2017·Granted Mar 29, 2022·0 cites·14 claims
- 0739US2021090946A1Multiple layer copper seedingINTEL CORP·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →