Inventor · disambiguated record
Yu-Yang Shen
Also filed as: Shen yu-yang
8 granted patents·1 pending application·6 citations·filing 2016–2025
79Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD9
Top patents by PatentIndex Score
9 records- 0190US2025344541A1Stacked substrate structure with inter-tier interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0285US11552027B2Semiconductor packaging device comprising a shield structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 10, 2023·1 cites·20 claims
- 0384US10867891B2Ion through-substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 0482US12382744B2Stacked substrate structure with inter-tier interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 0574US11817470B2Stacked substrate structure with inter-tier interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 0672US11037885B2Semiconductor packaging device comprising a shield structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·1 cites·20 claims
- 0771US10121812B2Stacked substrate structure with inter-tier interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 6, 2018·1 cites·20 claims
- 0866US11646247B2Ion through-substrate viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 9, 2023·0 cites·20 claims
- 0961US11043522B2Stacked substrate structure with inter-tier interconnectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 22, 2021·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →