Inventor · disambiguated record

Hyun Sub Shin

Also filed as: SHIN HYUN SUB

1 granted patent·4 citations·filing 2009–2009

25Inventor score

Technology areasH10W

Files withKIM JI-YUN1

Top patents by PatentIndex Score

1 record

0167US8659131B2Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cutKIM JI YUN·Filed 2009·Granted Feb 25, 2014·4 cites·3 claims

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