Inventor · disambiguated record

Tae Hun Yi

Also filed as: Yi tae hun

1 granted patent·0 citations·filing 2021–2021

5Inventor score

Technology areasH01L

Files withSK HYNIX INC1

Top patents by PatentIndex Score

1 record

0146US11569216B2Semiconductor package including stacked semiconductor chips and method for fabricating the semiconductor packageSK HYNIX INC·Filed 2021·Granted Jan 31, 2023·0 cites·22 claims

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