Inventor · disambiguated record
David E. Lazovsky
Also filed as: LAZOVSKY DAVID · LAZOVSKY DAVID E
56 granted patents·15 pending applications·431 citations·filing 2005–2025
98Inventor score
Top patents by PatentIndex Score
71 records- 0198US12468103B2Optically bridged multicomponent package with extended temperature rangeCELESTIAL AI INC·Filed 2025·Granted Nov 11, 2025·1 cites·21 claims
- 0298US12442998B2Optically bridged multicomponent package with extended temperature rangeCELESTIAL AI INC·Filed 2025·Granted Oct 14, 2025·2 cites·22 claims
- 0398US12443000B2Optically bridged multicomponent package with extended temperature rangeCELESTIAL AI INC·Filed 2025·Granted Oct 14, 2025·1 cites·21 claims
- 0498US12442997B2Optically bridged multicomponent package with extended temperature rangeCELESTIAL AI INC·Filed 2025·Granted Oct 14, 2025·1 cites·20 claims
- 0598US12436346B2Optically bridged multicomponent package with extended temperature rangeCELESTIAL AI INC·Filed 2025·Granted Oct 7, 2025·1 cites·21 claims
- 0698US12298608B1Optically bridged multicomponent package with extended temperature rangeCELESTIAL AI INC·Filed 2024·Granted May 13, 2025·10 cites·9 claims
- 0798US12242122B2Multicomponent photonically intra-die bridged assemblyCELESTIAL AI INC·Filed 2024·Granted Mar 4, 2025·9 cites·15 claims
- 0898US12216318B2Optical bridging element for separately stacked electrical ICsCELESTIAL AI INC·Filed 2024·Granted Feb 4, 2025·13 cites·11 claims
- 0998US12124095B2Optical multi-die interconnect bridge with optical interfaceCELESTIAL AI INC·Filed 2023·Granted Oct 22, 2024·10 cites·8 claims
- 1098US11835777B2Optical multi-die interconnect bridge (OMIB)CELESTIAL AI INC·Filed 2023·Granted Dec 5, 2023·28 cites·13 claims
- 1198US7309658B2Molecular self-assembly in substrate processingINTERMOLECULAR INC·Filed 2005·Granted Dec 18, 2007·97 cites·21 claims
- 1297US12164161B1Stacked-dies optically bridged multicomponent packageCELESTIAL AI INC·Filed 2024·Granted Dec 10, 2024·3 cites·13 claims
- 1396US9362231B2Molecular self-assembly in substrate processingINTERMOLECULAR INC·Filed 2015·Granted Jun 7, 2016·9 cites·12 claims
- 1496US8163631B2Methods for discretized processing and process sequence integration of regions of a substrateCHIANG TONY P·Filed 2011·Granted Apr 24, 2012·15 cites·16 claims
- 1596US7544574B2Methods for discretized processing of regions of a substrateINTERMOLECULAR INC·Filed 2006·Granted Jun 9, 2009·38 cites·24 claims
- 1695US11509397B2Balanced photonic architectures for matrix computationsCELESTIAL AI INC·Filed 2021·Granted Nov 22, 2022·27 cites·23 claims
- 1794US12164162B2Multicomponent photonically bridged assemblyCELESTIAL AI INC·Filed 2024·Granted Dec 10, 2024·1 cites·9 claims
- 1894US11817903B2Coherent photonic computing architecturesCELESTIAL AI INC·Filed 2021·Granted Nov 14, 2023·44 cites·28 claims
- 1994US8084400B2Methods for discretized processing and process sequence integration of regions of a substrateCHIANG TONY P·Filed 2006·Granted Dec 27, 2011·16 cites·23 claims
- 2094US7390739B2Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric regionLAZOVSKY DAVID E·Filed 2005·Granted Jun 24, 2008·18 cites·26 claims
- 2192US7902063B2Methods for discretized formation of masking and capping layers on a substrateINTERMOLECULAR INC·Filed 2006·Granted Mar 8, 2011·15 cites·18 claims
- 2290US7749881B2Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric regionINTERMOLECULAR INC·Filed 2005·Granted Jul 6, 2010·11 cites·8 claims
- 2390US2025362466A1Optically Bridged Multicomponent Package with Extended Temperature RangeCELESTIAL AI INC·Filed 2025·Application pending·0 cites
- 2490US2025355205A1Optically Bridged Multicomponent Package with Extended Temperature RangeCELESTIAL AI INC·Filed 2025·Application pending·0 cites
- 2590US2025362467A1Optically Bridged Multicomponent Package with Extended Temperature RangeCELESTIAL AI INC·Filed 2025·Application pending·0 cites
- 2687US8709943B2Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric regionINTERMOLECULAR INC·Filed 2013·Granted Apr 29, 2014·4 cites·20 claims
- 2787US8030772B2Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric regionINTERMOLECULAR INC·Filed 2008·Granted Oct 4, 2011·6 cites·16 claims
- 2887US7871928B2Methods for discretized processing of regions of a substrateINTERMOLECULAR INC·Filed 2009·Granted Jan 18, 2011·8 cites·19 claims
- 2986US8193090B2Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric regionLAZOVSKY DAVID E·Filed 2011·Granted Jun 5, 2012·4 cites·16 claims
- 3084US12442999B2Optically bridged multicomponent package with extended temperature rangeCELESTIAL AI INC·Filed 2025·Granted Oct 14, 2025·0 cites·20 claims
- 3184US8803124B2Creating an embedded reram memory from a high-K metal gate transistor structurePRAMANIK DIPANKAR·Filed 2012·Granted Aug 12, 2014·5 cites·21 claims
- 3284US8372759B2Molecular self-assembly in substrate processingINTERMOLECULAR INC·Filed 2011·Granted Feb 12, 2013·4 cites·11 claims
- 3383US12399333B2Optical multi-die interconnect bridge with electrical and optical interfacesCELESTIAL AI INC·Filed 2023·Granted Aug 26, 2025·0 cites·14 claims
- 3483US8058154B2Methods for discretized processing and process sequence integration of regions of a substrateCHIANG TONY P·Filed 2008·Granted Nov 15, 2011·4 cites·18 claims
- 3582US2025258606A1Photonic memory fabric for system memory interconnectionCELESTIAL AI INC·Filed 2025·Application pending·0 cites
- 3680US8975180B2Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric regionINTERMOLECULAR INC·Filed 2014·Granted Mar 10, 2015·2 cites·16 claims
- 3780US8697606B2Methods for discretized processing and process sequence integration of regions of a substrateCHIANG TONY P·Filed 2011·Granted Apr 15, 2014·2 cites·20 claims
- 3880US8039383B2Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric regionsINTERMOLECULAR INC·Filed 2010·Granted Oct 18, 2011·3 cites·6 claims
- 3979US7972972B2Molecular self-assembly in substrate processingINTERMOLECULAR INC·Filed 2007·Granted Jul 5, 2011·4 cites·11 claims
- 4079US2025244876A1Multi-chip electro-photonic networks and photonic memory fabrics for interconnecting multiple circuit packagesCELESTIAL AI INC·Filed 2025·Application pending·0 cites
- 4178US8995166B2Multi-level memory array having resistive elements for multi-bit data storageINTERMOLECULAR INC·Filed 2012·Granted Mar 31, 2015·5 cites·18 claims
- 4278US8461044B2Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric regionLAZOVSKY DAVID E·Filed 2012·Granted Jun 11, 2013·2 cites·16 claims
- 4376US12271595B2Photonic memory fabric for system memory interconnectionCELESTIAL AI INC·Filed 2022·Granted Apr 8, 2025·0 cites·24 claims
- 4475US8883633B2Molecular self-assembly in substrate processingLAZOVSKY DAVID E·Filed 2011·Granted Nov 11, 2014·2 cites·7 claims
- 4574US9368400B2Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric regionINTERMOLECULAR INC·Filed 2015·Granted Jun 14, 2016·1 cites·20 claims
- 4670US8815753B2Molecular self-assembly in substrate processingINTERMOLECULAR INC·Filed 2012·Granted Aug 26, 2014·1 cites·20 claims
- 4770US8343866B2Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric regionINTERMOLECULAR INC·Filed 2011·Granted Jan 1, 2013·1 cites·13 claims
- 4869US9331279B2Creating an embedded ReRAM memory from a high-k metal gate transistor structureINTERMOLECULAR INC·Filed 2015·Granted May 3, 2016·1 cites·20 claims
- 4968US8586485B2Molecular self-assembly in substrate processingLAZOVSKY DAVID E·Filed 2011·Granted Nov 19, 2013·1 cites·9 claims
- 5062US9076716B2Methods for discretized processing and process sequence integration of regions of a substrateINTERMOLECULAR INC·Filed 2013·Granted Jul 7, 2015·0 cites·20 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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