Inventor · disambiguated record
Jiongxin Lu
Also filed as: LU JIONGXIN
3 granted patents·10 pending applications·0 citations·filing 2015–2024
45Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0168US2024162134A1Varied ball ball-grid-array (bga) packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0263US2023017445A1Scalable Extreme Large Size Substrate IntegrationAPPLE INC·Filed 2022·Application pending·0 cites
- 0361US12469765B2Thermally enhanced chip-on-wafer or wafer-on-wafer bondingAPPLE INC·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 0458US11404337B2Scalable extreme large size substrate integrationAPPLE INC·Filed 2019·Granted Aug 2, 2022·0 cites·17 claims
- 0557US2024105704A13D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer BondingAPPLE INC·Filed 2023·Application pending·0 cites
- 0655US11916003B2Varied ball ball-grid-array (BGA) packagesINTEL CORP·Filed 2019·Granted Feb 27, 2024·0 cites·22 claims
- 0755US2025014960A1Molding compound layers in semiconductor packagesAPPLE INC·Filed 2023·Application pending·0 cites
- 0854US2024105702A13D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer BondingAPPLE INC·Filed 2023·Application pending·0 cites
- 0954US2025112176A1Frame structures in semiconductor packagesAPPLE INC·Filed 2023·Application pending·0 cites
- 1052US2025015027A1Bonding structures in semiconductor packagesAPPLE INC·Filed 2023·Application pending·0 cites
- 1151US2024315054A1Upside-Down DRAM Package StructureAPPLE INC·Filed 2023·Application pending·0 cites
- 1235US2019304805A1Electronic device and method for manufacturing the sameINTEL CORP·Filed 2018·Application pending·0 cites
- 1329US2017053858A1Substrate on substrate packageINTEL CORP·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →