Inventor · disambiguated record
Frank Kuo
Also filed as: KUO FRANK
26 granted patents·2 pending applications·498 citations·filing 2001–2017
97Inventor score
Top patents by PatentIndex Score
28 records- 0198US9126647B2Bicycle seat post structureKUO FRANK·Filed 2013·Granted Sep 8, 2015·125 cites·8 claims
- 0296US9589929B2Method for fabricating stack die packageVISHAY SILICONIX·Filed 2013·Granted Mar 7, 2017·28 cites·20 claims
- 0394US8822273B2Dual lead frame semiconductor package and method of manufactureKUO FRANK·Filed 2011·Granted Sep 2, 2014·20 cites·12 claims
- 0491US9376159B2Direction restricting device for the inner and outer tubes of a bicycle seat postTAIWAN HODAKA IND CO LTD·Filed 2013·Granted Jun 28, 2016·15 cites·12 claims
- 0588US9184152B2Dual lead frame semiconductor package and method of manufactureKUO FRANK·Filed 2014·Granted Nov 10, 2015·8 cites·7 claims
- 0688USD466873SSemiconductor chip packageSILICONIX INC·Filed 2001·Granted Dec 10, 2002·43 cites·1 claims
- 0787USD472528SSemiconductor chip packageSILICONIX INC·Filed 2001·Granted Apr 1, 2003·56 cites·1 claims
- 0887US6465276B2Power semiconductor package and method for making the sameSILICONX TAIWAN LTD·Filed 2001·Granted Oct 15, 2002·55 cites·3 claims
- 0986US9966330B2Stack die packageVISHAY SILICONIX·Filed 2013·Granted May 8, 2018·8 cites·20 claims
- 1086US8471381B2Complete power management system implemented in a single surface mount packageOWYANG KING·Filed 2006·Granted Jun 25, 2013·13 cites·22 claims
- 1185US10546840B2Method for fabricating stack die packageVISHAY SILICONIX·Filed 2017·Granted Jan 28, 2020·4 cites·20 claims
- 1285US9595503B2Dual lead frame semiconductor package and method of manufactureKUO FRANK·Filed 2014·Granted Mar 14, 2017·6 cites·8 claims
- 1382US7394150B2Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleysSILICONIX INC·Filed 2004·Granted Jul 1, 2008·35 cites·17 claims
- 1482US7238551B2Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleysSILICONIX INC·Filed 2004·Granted Jul 3, 2007·37 cites·18 claims
- 1580US8586419B2Semiconductor packages including die and L-shaped lead and method of manufactureJAUNAY SERGE·Filed 2010·Granted Nov 19, 2013·9 cites·16 claims
- 1678US9567027B2Bicycle seat post height adjustment mechanismTAIWAN HODAKA IND CO LTD·Filed 2014·Granted Feb 14, 2017·6 cites·9 claims
- 1775US9376153B1Control device of the height adjustment for a bicycle seat postTAIWAN HODAKA IND CO LTD·Filed 2015·Granted Jun 28, 2016·3 cites·4 claims
- 1875US8928138B2Complete power management system implemented in a single surface mount packageOWYANG KING·Filed 2010·Granted Jan 6, 2015·3 cites·19 claims
- 1972US10229893B2Dual lead frame semiconductor package and method of manufactureVISHAY SILICONIX·Filed 2017·Granted Mar 12, 2019·1 cites·20 claims
- 2059US9093359B2Complete power management system implemented in a single surface mount packageOWYANG KING·Filed 2006·Granted Jul 28, 2015·1 cites·21 claims
- 2159US6856006B2Encapsulation method and leadframe for leadless semiconductor packagesSILICONIX TAIWAN LTD·Filed 2002·Granted Feb 15, 2005·7 cites·7 claims
- 2259US6744119B2Leadframe having slots in a die padSILICONIX TAIWAN LTD·Filed 2001·Granted Jun 1, 2004·11 cites·20 claims
- 2354US8928157B2Encapsulation techniques for leadless semiconductor packagesKUO FRANK·Filed 2009·Granted Jan 6, 2015·0 cites·8 claims
- 2451US9187141B2Control mechanism of the adjustable seat post for a bicycleTAIWAN HODAKA IND CO LTD·Filed 2014·Granted Nov 17, 2015·1 cites·4 claims
- 2551US2015331438A1Complete power management system implemented in a single surface mount packageVISHAY SILICONIX·Filed 2015·Application pending·0 cites
- 2649US7501086B2Encapsulation method for leadless semiconductor packagesVISHAY SILICONIX·Filed 2004·Granted Mar 10, 2009·2 cites·14 claims
- 2740US6414362B1Power semiconductor deviceSILICONX TAIWAN LTD·Filed 2001·Granted Jul 2, 2002·1 cites·1 claims
- 2833US2001052641A1Power semiconductor deviceFiled 2001·Application pending·0 cites
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