Inventor · disambiguated record
Takafumi Tsujisawa
Also filed as: TSUJISAWA TAKAFUMI
6 granted patents·1 pending application·40 citations·filing 1999–2016
79Inventor score
Top patents by PatentIndex Score
7 records- 0169US7748112B2Component mounting apparatus and component mounting methodPANASONIC CORP·Filed 2005·Granted Jul 6, 2010·6 cites·12 claims
- 0258US6439447B1Bump joining judging device and method, and semiconductor component production device and methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Aug 27, 2002·23 cites·40 claims
- 0350US6572005B2Bump-joining methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 3, 2003·3 cites·6 claims
- 0446US10314177B2Component mounting methodPANASONIC IP MAN CO LTD·Filed 2016·Granted Jun 4, 2019·0 cites·6 claims
- 0542US6321973B1Bump joining methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Nov 27, 2001·8 cites·2 claims
- 0640US2003205607A1Bump joining methodFiled 2003·Application pending·0 cites
- 0739US7552528B2Wafer expanding device, component feeder, and expanding method for wafer sheetPANASONIC CORP·Filed 2005·Granted Jun 30, 2009·0 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →