Inventor · disambiguated record
Hui-Chang Chen
Also filed as: CHEN HUI-CHANG
16 granted patents·4 pending applications·132 citations·filing 2003–2011
93Inventor score
Top patents by PatentIndex Score
20 records- 0191US8368192B1Multi-chip memory package with a small substratePOWERTECH TECHNOLOGY INC·Filed 2011·Granted Feb 5, 2013·14 cites·13 claims
- 0286US6940301B2Test pad array for contact resistance measuring of ACF bonds on a liquid crystal display panelAU OPTRONICS CORP·Filed 2003·Granted Sep 6, 2005·33 cites·16 claims
- 0385US7576807B2Display panel having particular connections between conductive structure with shorting bars and testing linesAU OPTRONICS CORP·Filed 2006·Granted Aug 18, 2009·8 cites·13 claims
- 0482US7375787B2Liquid crystal display devicesAU OPTRONICS CORP·Filed 2006·Granted May 20, 2008·9 cites·6 claims
- 0580US7211738B2Bonding pad structure for a display device and fabrication method thereofAU OPTRONICS CORP·Filed 2004·Granted May 1, 2007·21 cites·10 claims
- 0679US7489382B2Liquid crystal display moduleAU OPTRONICS CORP·Filed 2007·Granted Feb 10, 2009·7 cites·12 claims
- 0770US7507592B2Bonding pad structure for a display device and fabrication method thereofAU OPTRONICS CORP·Filed 2007·Granted Mar 24, 2009·4 cites·19 claims
- 0866US7023095B2CarrierAU OPTRONICS CORP·Filed 2004·Granted Apr 4, 2006·9 cites·16 claims
- 0965US7139060B2Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive filmAU OPTRONICS CORP·Filed 2004·Granted Nov 21, 2006·11 cites·26 claims
- 1061US7265804B2Liquid crystal display module with a filled wiring structure having square shaped pads distributed like a matrixAU OPTRONICS CORP·Filed 2004·Granted Sep 4, 2007·6 cites·7 claims
- 1158US7390734B2Thin film transistor substrate and manufacturing method thereofAU OPTRONICS CORP·Filed 2007·Granted Jun 24, 2008·1 cites·5 claims
- 1256US7030622B2Bonding configuration structure for facilitating electrical testing in a bonding process and a testing method using the sameAU OPTRONICS CORP·Filed 2005·Granted Apr 18, 2006·2 cites·18 claims
- 1348US7576992B2Flexible printed circuit and display device utilizing the sameAU OPTRONICS CORP·Filed 2006·Granted Aug 18, 2009·0 cites·22 claims
- 1448US7245012B2Thin film transistor substrate and manufacturing method thereofAU OPTRONICS CORP·Filed 2004·Granted Jul 17, 2007·3 cites·31 claims
- 1547US7538278B2Printed circuit board for preventing increase of thermal expansionAU OPTRONICS CORP·Filed 2004·Granted May 26, 2009·2 cites·7 claims
- 1647US7142262B2Liquid crystal display moduleAU OPTRONICS CORP·Filed 2004·Granted Nov 28, 2006·2 cites·15 claims
- 1742US2007103632A1Liquid crystal display panel module and flexible printed circuit board thereofAU OPTRONICS CORP·Filed 2006·Application pending·0 cites
- 1839US2013069223A1Flash memory card without a substrate and its fabrication methodCHEN HUI-CHANG·Filed 2011·Application pending·0 cites
- 1938US2013009294A1Multi-chip package having leaderframe-type contact fingersCHEN HUI-CHANG·Filed 2011·Application pending·0 cites
- 2032US2005253993A1Flat panel display and assembly process of the flat panel displayCHEN YI-RU·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →