Inventor · disambiguated record
Mark Raffetto
Also filed as: RAFFETTO MARK
7 granted patents·162 citations·filing 2002–2011
84Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0194US6747298B2Collets for bonding of light emitting diodes having shaped substratesCREE INC·Filed 2002·Granted Jun 8, 2004·89 cites·36 claims
- 0291US6888167B2Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bondingCREE MICROWAVE INC·Filed 2002·Granted May 3, 2005·57 cites·35 claims
- 0373US7259033B2Flip-chip bonding of light emitting devicesCREE MICROWAVE LLC·Filed 2004·Granted Aug 21, 2007·15 cites·17 claims
- 0452US7608860B2Light emitting devices suitable for flip-chip bondingCREE INC·Filed 2007·Granted Oct 27, 2009·0 cites·22 claims
- 0545US8759868B2Ultra-thin ohmic contacts for p-type nitride light emitting devicesRAFFETTO MARK·Filed 2011·Granted Jun 24, 2014·0 cites·16 claims
- 0645US7341175B2Bonding of light emitting diodes having shaped substratesCREE INC·Filed 2004·Granted Mar 11, 2008·1 cites·11 claims
- 0742US8089090B2Ultra-thin ohmic contacts for p-type nitride light emitting devicesRAFFETTO MARK·Filed 2005·Granted Jan 3, 2012·0 cites·20 claims
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