Inventor · disambiguated record
Te Hua Lin
Also filed as: LIN TE HUA
3 granted patents·81 citations·filing 1995–2001
75Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0174US6653224B1Methods for fabricating interconnect structures having Low K dielectric propertiesLAM RES CORP·Filed 2001·Granted Nov 25, 2003·26 cites·19 claims
- 0271US5883436AContact and via fabrication technologiesINTEL CORP·Filed 1997·Granted Mar 16, 1999·37 cites·14 claims
- 0354US6495470B2Contact and via fabrication technologiesINTEL CORP·Filed 1995·Granted Dec 17, 2002·18 cites·21 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →