Inventor · disambiguated record
Stefan Wein
Also filed as: WEIN STEFAN
7 granted patents·4 pending applications·263 citations·filing 2002–2006
88Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG8
Top patents by PatentIndex Score
11 records- 0191US6902951B2Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic deviceINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jun 7, 2005·67 cites·6 claims
- 0290US6710455B2Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 23, 2004·65 cites·15 claims
- 0387US7276783B2Electronic component with a plastic package and method for productionINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 2, 2007·54 cites·36 claims
- 0486US7517722B2Method of producing a universal semiconductor housing with precrosslinked plastic embedding compoundsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 14, 2009·13 cites·23 claims
- 0582US6867471B2Universal package for an electronic component with a semiconductor chip and method for producing the universal packageINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 15, 2005·33 cites·38 claims
- 0680US6683374B2Electronic component and process for producing the electronic componentINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 27, 2004·30 cites·15 claims
- 0745US2005184375A1Electronic device configured as a multichip module, leadframe and panel with leadframe positionsINFINEON TECHNOLOGIES AG·Filed 2005·Application pending·0 cites
- 0843US6953992B2Electronic component with at least one semiconductor chip and method for its manufactureINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 11, 2005·1 cites·8 claims
- 0939US2004043515A1Universal semiconductor housing with precrosslinked plastic embedding compounds, and method of producing the semiconductor housingFiled 2003·Application pending·0 cites
- 1035US2003042591A1Electronic component with at least two stacked semiconductor chips, and fabrication methodFiled 2002·Application pending·0 cites
- 1135US2003043555A1Electronic component with at least two stacked semiconductor chips and process for producing the electronic componentFiled 2002·Application pending·0 cites
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