Inventor · disambiguated record
David C. Noice
Also filed as: NOICE DAVID · NOICE DAVID C · NOICE DAVID COOKE
15 granted patents·1 pending application·284 citations·filing 2002–2012
94Inventor score
Files withCADENCE DESIGN SYSTEMS INC9NOICE DAVID C2NOICE DAVID1SCHEFFER LOUIS K1SEZGINER ABDURRAHMAN1
Top patents by PatentIndex Score
16 records- 0193US8782586B2Method, system, and program product for routing an integrated circuit to be manufactured by doubled patterningSEZGINER ABDURRAHMAN·Filed 2009·Granted Jul 15, 2014·51 cites·24 claims
- 0291US7574685B1Method, system, and article of manufacture for reducing via failures in an integrated circuit designCADENCE DESIGN SYSTEMS INC·Filed 2007·Granted Aug 11, 2009·34 cites·24 claims
- 0390US7661078B1Method and system for implementing metal fillCADENCE DESIGN SYSTEMS INC·Filed 2005·Granted Feb 9, 2010·32 cites·32 claims
- 0487US7328419B2Place and route tool that incorporates a metal-fill mechanismCADENCE DESIGN SYSTEMS INC·Filed 2002·Granted Feb 5, 2008·47 cites·26 claims
- 0585US8713507B1Method and apparatus for efficiently inserting fills in an integrated circuit layoutNOICE DAVID C·Filed 2012·Granted Apr 29, 2014·10 cites·33 claims
- 0685US7900166B2Method to produce an electrical model of an integrated circuit substrate and related system and article of manufactureCADENCE DESIGN SYSTEMS INC·Filed 2007·Granted Mar 1, 2011·16 cites·18 claims
- 0784US8136056B2Method and system for incorporation of patterns and design rule checkingSCHEFFER LOUIS K·Filed 2006·Granted Mar 13, 2012·15 cites·41 claims
- 0879US9262359B1Method and system for implementing pipeline flip-flopsNOICE DAVID C·Filed 2009·Granted Feb 16, 2016·16 cites·24 claims
- 0978US7865858B2Method, system, and article of manufacture for implementing metal-fill with power or ground connectionCADENCE DESIGN SYSTEMS INC·Filed 2007·Granted Jan 4, 2011·7 cites·27 claims
- 1078US7231624B2Method, system, and article of manufacture for implementing metal-fill with power or ground connectionCADENCE DESIGN SYSTEMS INC·Filed 2002·Granted Jun 12, 2007·22 cites·23 claims
- 1175US8789005B1Method and apparatus for efficiently processing an integrated circuit layoutUMINO KIMIKO·Filed 2012·Granted Jul 22, 2014·10 cites·21 claims
- 1275US8161425B1Method and system for implementing timing aware metal fillNOICE DAVID·Filed 2006·Granted Apr 17, 2012·11 cites·54 claims
- 1372US7877713B2Method and apparatus for substrate noise analysis using substrate tile model and tile gridCADENCE DESIGN SYSTEMS INC·Filed 2007·Granted Jan 25, 2011·4 cites·18 claims
- 1469US8327300B2Place and route tool that incorporates a metal-fill mechanismVUONG THANH·Filed 2008·Granted Dec 4, 2012·4 cites·19 claims
- 1555US7287324B2Method, system, and article of manufacture for implementing metal-fill on an integrated circuitCADENCE DESIGN SYSTEMS INC·Filed 2002·Granted Oct 30, 2007·5 cites·46 claims
- 1643US2004098688A1Method, system, and article of manufacture for implementing long wire metal-fillCADENCE DESIGN SYSTEMS INC·Filed 2002·Application pending·0 cites
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