Inventor · disambiguated record
Haruo Hyoudo
Also filed as: HYOUDO HARUO
10 granted patents·1 pending application·140 citations·filing 1999–2002
90Inventor score
Technology areasH10W
Files withSANYO ELECTRIC CO10
Top patents by PatentIndex Score
11 records- 0186US6365433B1Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2000·Granted Apr 2, 2002·47 cites·11 claims
- 0279US6521482B1Manufacturing method for a semiconductor deviceSANYO ELECTRIC CO·Filed 2000·Granted Feb 18, 2003·29 cites·16 claims
- 0373US6285067B1Electronic device and method for manufacturing the sameSANYO ELECTRIC CO·Filed 2000·Granted Sep 4, 2001·17 cites·3 claims
- 0472US6309911B2Method of fabricating semiconductor deviceSANYO ELECTRIC CO·Filed 2001·Granted Oct 30, 2001·15 cites·7 claims
- 0564US6461893B2Method for manufacturing an electronic deviceSANYO ELECTRIC CO·Filed 2001·Granted Oct 8, 2002·10 cites·16 claims
- 0659US6368893B1Method of fabricating semiconductor deviceSANYO ELECTRIC CO·Filed 2000·Granted Apr 9, 2002·8 cites·5 claims
- 0742US6197616B1Method of fabricating semiconductor deviceSANYO ELECTRIC CO·Filed 1999·Granted Mar 6, 2001·8 cites·6 claims
- 0839US6784523B2Method of fabricating semiconductor deviceSANYO ELECTRIC CO·Filed 2001·Granted Aug 31, 2004·0 cites·20 claims
- 0939US6511864B2Method of fabricating semiconductor deviceSANYO ELECTRIC CO·Filed 2001·Granted Jan 28, 2003·0 cites·8 claims
- 1037US6326232B1Method of fabricating semiconductor deviceSANYO ELECTRIC CO·Filed 1999·Granted Dec 4, 2001·6 cites·20 claims
- 1137US2002081769A1Method of fabricating semiconductor deviceFiled 2002·Application pending·0 cites
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