Inventor
RANDAZZO TODD A
US42 patents
⚠️ This page may combine multiple inventors who share the name “RANDAZZO TODD A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LSI LOGIC CORP
26 patentsUS6316817B1Nov 13, 2001
MeV implantation to form vertically modulated N+ buried layer in an NPN bipolar transistor
LSI LOGIC CORP46 citations96
US6130117AOct 10, 2000
Simple bicmos process for creation of low trigger voltage SCR and zener diode pad protection
LSI LOGIC CORP53 citations96
US6342734B1Jan 29, 2002
Interconnect-integrated metal-insulator-metal capacitor and method of fabricating same
LSI LOGIC CORP77 citations95
US6794310B1Sep 21, 2004
Method and apparatus for determining temperature of a semiconductor wafer during fabrication thereof
LSI LOGIC CORP17 citations93
US6328802B1Dec 11, 2001
Method and apparatus for determining temperature of a semiconductor wafer during fabrication thereof
LSI LOGIC CORP17 citations93
US6545305B1Apr 8, 2003
Linear capacitor and process for making same
LSI LOGIC CORP17 citations92
US6855586B2Feb 15, 2005
Low voltage breakdown element for ESD trigger device
LSI LOGIC CORP16 citations91
US6822282B2Nov 23, 2004
Analog capacitor in dual damascene process
LSI LOGIC CORP22 citations91
US6063672AMay 16, 2000
NMOS electrostatic discharge protection device and method for CMOS integrated circuit
LSI LOGIC CORP31 citations91
US6514824B1Feb 4, 2003
Semiconductor device with a pair of transistors having dual work function gate electrodes
LSI LOGIC CORP28 citations90
US6211555B1Apr 3, 2001
Semiconductor device with a pair of transistors having dual work function gate electrodes
LSI LOGIC CORP18 citations90
US6614283B1Sep 2, 2003
Voltage level shifter
LSI LOGIC CORP52 citations89
US6825546B1Nov 30, 2004
CMOS varactor with constant dC/dV characteristic
LSI LOGIC CORP14 citations82
US6710990B2Mar 23, 2004
Low voltage breakdown element for ESD trigger device
LSI LOGIC CORP14 citations82
US6924689B2Aug 2, 2005
Level shifter reference generator
LSI LOGIC CORP16 citations81
US6359314B1Mar 19, 2002
Swapped drain structures for electrostatic discharge protection
LSI LOGIC CORP5 citations74
US6133077AOct 17, 2000
Formation of high-voltage and low-voltage devices on a semiconductor substrate
LSI LOGIC CORP11 citations74
US6596579B1Jul 22, 2003
Method of forming analog capacitor dual damascene process
LSI LOGIC CORP10 citations72
US6501318B1Dec 31, 2002
High speed input buffer circuit
LSI LOGIC CORP11 citations71
US6587322B2Jul 1, 2003
Swapped drain structures for electrostatic discharge protection
LSI LOGIC CORP2 citations63
US6093585AJul 25, 2000
High voltage tolerant thin film transistor
LSI LOGIC CORP5 citations63
US7176082B2Feb 13, 2007
Analog capacitor in dual damascene process
LSI LOGIC CORP4 citations61
US6931560B1Aug 16, 2005
Programmable transmit SCSI equalization
LSI LOGIC CORP6 citations60
US6621299B1Sep 16, 2003
Control circuit for power
LSI LOGIC CORP5 citations58
US7180360B2Feb 20, 2007
Method and apparatus for summing DC voltages
LSI LOGIC CORP0 citations52
US6194766B1Feb 27, 2001
Integrated circuit having low voltage and high voltage devices on a common semiconductor substrate
LSI LOGIC CORP1 citations52
SYMBIOS INC
4 patentsUS5858828AJan 12, 1999
Use of MEV implantation to form vertically modulated N+ buried layer in an NPN bipolar transistor
SYMBIOS INC48 citations96
US5821572AOct 13, 1998
Simple BICMOS process for creation of low trigger voltage SCR and zener diode pad protection
SYMBIOS INC60 citations96
US5838616ANov 17, 1998
Gate edge aligned EEPROM transistor
SYMBIOS INC9 citations74
US5780329AJul 14, 1998
Process for fabricating a moderate-depth diffused emitter bipolar transistor in a BICMOS device without using an additional mask
SYMBIOS INC8 citations73
ATMEL CORP
4 patentsUS5493142AFeb 20, 1996
Input/output transistors with optimized ESD protection
ATMEL CORP77 citations96
US5440159AAug 8, 1995
Single layer polysilicon EEPROM having uniform thickness gate oxide/capacitor dielectric layer
ATMEL CORP34 citations92
US5340764AAug 23, 1994
Integration of high performance submicron CMOS and dual-poly non-volatile memory devices using a third polysilicon layer
ATMEL CORP16 citations73
USRE36777EJul 11, 2000
Integration of high performance submicron CMOS and dual-poly non-volatile memory devices using a third polysilicon layer
ATMEL CORP1 citations51