Inventor · disambiguated record
Satoru Kuramochi
Also filed as: KURAMOCHI SATORU
27 granted patents·6 pending applications·972 citations·filing 1990–2024
97Inventor score
Files withDAINIPPON PRINTING CO LTD29KURAMOCHI SATORU1MITSUI MINING & SMELTING CO LTD1MORI TOSHIAKI1USHIO ELECTRIC INC1
Top patents by PatentIndex Score
33 records- 0198US6634564B2Contact/noncontact type data carrier moduleDAINIPPON PRINTING CO LTD·Filed 2001·Granted Oct 21, 2003·277 cites·39 claims
- 0297US7690109B2Method of manufacturing a multilayer wiring boardDAINIPPON PRINTING CO LTD·Filed 2006·Granted Apr 6, 2010·58 cites·9 claims
- 0397US5909083AProcess for producing plasma display panelDAINIPPON PRINTING CO LTD·Filed 1997·Granted Jun 1, 1999·151 cites·32 claims
- 0495US8069560B2Method of manufacturing multilayer wiring boardMORI TOSHIAKI·Filed 2010·Granted Dec 6, 2011·44 cites·24 claims
- 0595US7091589B2Multilayer wiring board and manufacture method thereofDAINIPPON PRINTING CO LTD·Filed 2003·Granted Aug 15, 2006·99 cites·25 claims
- 0695US6156433AElectrode for plasma display panel and process for producing the sameDAINIPPON PRINTING CO LTD·Filed 1997·Granted Dec 5, 2000·105 cites·20 claims
- 0794US5992320ATransfer sheet, and pattern-forming methodDAINIPPON PRINTING CO LTD·Filed 1997·Granted Nov 30, 1999·126 cites·8 claims
- 0892US11728243B2Through electrode substrate and semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2020·Granted Aug 15, 2023·2 cites·18 claims
- 0990US10847444B2Through electrode substrate and semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2019·Granted Nov 24, 2020·4 cites·20 claims
- 1090US10256176B2Through-hole electrode substrate and semiconductor device using through-hole electrode substrateDAINIPPON PRINTING CO LTD·Filed 2016·Granted Apr 9, 2019·6 cites·20 claims
- 1187US10790221B2Through-hole electrode substrateDAINIPPON PRINTING CO LTD·Filed 2020·Granted Sep 29, 2020·2 cites·20 claims
- 1285US2024404934A1Through-hole electrode substrateDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 1385US2025046681A1Through electrode substrate and semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 1482US12183661B2Through electrode substrate and semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·18 claims
- 1582US5477313ALiquid development and transfer apparatus for electrostatic latent imageDAINIPPON PRINTING CO LTD·Filed 1993·Granted Dec 19, 1995·21 cites·5 claims
- 1679US12136591B2Through electrode substrate and semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2023·Granted Nov 5, 2024·0 cites·18 claims
- 1777US12080637B2Through-hole electrode substrateDAINIPPON PRINTING CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 1877US6333140B1Electrode for plasma display panel and process for producing the sameDAINIPPON PRINTING CO LTD·Filed 2000·Granted Dec 25, 2001·11 cites·3 claims
- 1973US7772684B2Electronic device and production method thereofDAINIPPON PRINTING CO LTD·Filed 2004·Granted Aug 10, 2010·17 cites·6 claims
- 2073US6605814B1Apparatus for curing resistUSHIO ELECTRIC INC·Filed 2000·Granted Aug 12, 2003·21 cites·2 claims
- 2170US11362028B2Through-hole electrode substrateDAINIPPON PRINTING CO LTD·Filed 2020·Granted Jun 14, 2022·0 cites·2 claims
- 2269US11742273B2Through electrode substrate and semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·15 claims
- 2366US7011931B2Electrode for plasma display panel and process for producing the sameDAINIPPON PRINTING CO LTD·Filed 2001·Granted Mar 14, 2006·5 cites·6 claims
- 2463US10580727B2Through-hole electrode substrateDAINIPPON PRINTING CO LTD·Filed 2019·Granted Mar 3, 2020·0 cites·20 claims
- 2560US10950533B2Through electrode substrate and semiconductor deviceDAINIPPON PRINTING CO LTD·Filed 2019·Granted Mar 16, 2021·0 cites·26 claims
- 2657US2025149527A1Semiconductor package, semiconductor package intermediate, redistribution layer chip, redistribution layer chip intermediate, method of manufacturing semiconductor package, and method of manufacturing semiconductor package intermediateDAINIPPON PRINTING CO LTD·Filed 2023·Application pending·0 cites
- 2756US2024429149A1Through-via substrate, mounting substrate, and method for manufacturing through-via substrateDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 2855US5165343APrinting plate and printing processDAINIPPON PRINTING CO LTD·Filed 1990·Granted Nov 24, 1992·16 cites·5 claims
- 2952US2024339389A1Through via substrateDAINIPPON PRINTING CO LTD·Filed 2022·Application pending·0 cites
- 3048US6141517ALiquid development apparatus for developing electrostatic latent images using a plurality of electrodesDAINIPPON PRINTING CO LTD·Filed 1997·Granted Oct 31, 2000·6 cites·9 claims
- 3148US2022105494A1Catalyst for purifying exhaust gasMITSUI MINING & SMELTING CO LTD·Filed 2020·Application pending·0 cites
- 3243US8114714B2Electronic device and production method thereofKURAMOCHI SATORU·Filed 2007·Granted Feb 14, 2012·0 cites·34 claims
- 3332US5666614ALiquid development apparatus for electrostatic latent image using a plurality of electrodesDAINIPPON PRINTING CO LTD·Filed 1995·Granted Sep 9, 1997·1 cites·3 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →