Inventor · disambiguated record
Hsiao-Lan Yeh
Also filed as: YEH HSIAO-LAN
7 granted patents·1 pending application·22 citations·filing 1996–2023
78Inventor score
Top patents by PatentIndex Score
8 records- 0175US9947716B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Apr 17, 2018·2 cites·10 claims
- 0254US12463102B2Semiconductor device structure and method for forming the sameXINTEC INC·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
- 0343US10388541B2Wafer coating system and method of manufacturing chip packageXINTEC INC·Filed 2016·Granted Aug 20, 2019·0 cites·14 claims
- 0442US6019849AMethod and apparatus for automatic purge of HMDS vapor pipingTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Feb 1, 2000·11 cites·10 claims
- 0540US9875912B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Jan 23, 2018·0 cites·16 claims
- 0633US2017012081A1Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Application pending·0 cites
- 0732US5763006AMethod and apparatus for automatic purge of HMDS vapor pipingTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Jun 9, 1998·5 cites·8 claims
- 0830US5908041AMethod for cleaning a photoresist developer spray stream nozzleTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Jun 1, 1999·4 cites·12 claims
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