Inventor · disambiguated record
Atsushi Matsushita
Also filed as: MATSUSHITA ATSUSHI
25 granted patents·6 pending applications·372 citations·filing 1989–2021
96Inventor score
Files withTOKYO OHKA KOGYO CO LTD14BECKMAN COULTER INC2CREATIC JAPAN INC2INAO YOSHIHIRO2ROHM CO LTD2
Top patents by PatentIndex Score
31 records- 0194US7538038B2Method of removing resist, semiconductor device thereby and method of manufacturing a semiconductor deviceSONY CORP·Filed 2005·Granted May 26, 2009·32 cites·18 claims
- 0291US5435880APlasma processing apparatusTOKYO OHKA KOGYO CO LTD·Filed 1993·Granted Jul 25, 1995·76 cites·22 claims
- 0385US5364488ACoaxial plasma processing apparatusTOKYO OHKA KOGYO CO LTD·Filed 1992·Granted Nov 15, 1994·47 cites·16 claims
- 0482US6836073B2Simultaneous discharge apparatusTOKYO OHKA KOGYO CO LTD·Filed 2003·Granted Dec 28, 2004·18 cites·14 claims
- 0581US5846329APlasma processing apparatusTOKYO OHKA KOGYO CO LTD·Filed 1997·Granted Dec 8, 1998·72 cites·21 claims
- 0678US9048311B2Laminate and method for separating the sameINAO YOSHIHIRO·Filed 2011·Granted Jun 2, 2015·4 cites·5 claims
- 0777US6509279B2Methods for processing a coating film and for manufacturing a semiconductor elementTOKYO OHKA KOGYO CO LTD·Filed 2001·Granted Jan 21, 2003·15 cites·5 claims
- 0870US5220339AAntenna having a core of an amorphous materialCREATIC JAPAN INC·Filed 1989·Granted Jun 15, 1993·32 cites·4 claims
- 0968US9492986B2Laminate and method for separating the sameINAO YOSHIHIRO·Filed 2011·Granted Nov 15, 2016·2 cites·7 claims
- 1068US9099534B2Manufacturing method of semiconductor device, semiconductor device and electronic apparatusSONY CORP·Filed 2014·Granted Aug 4, 2015·2 cites·12 claims
- 1166US9023172B2Method of manufacturing laminateTOKYO OHKA KOGYO CO LTD·Filed 2013·Granted May 5, 2015·2 cites·18 claims
- 1264US5220338AAntenna elementCREATIC JAPAN INC·Filed 1991·Granted Jun 15, 1993·32 cites·14 claims
- 1363US6664199B2Coating liquid for forming a silica group coating film having a small dielectric constantTOKYO OHKA KOGYO CO LTD·Filed 2002·Granted Dec 16, 2003·6 cites·7 claims
- 1462US8287807B2Analyzer and communication methodMATSUSHITA ATSUSHI·Filed 2008·Granted Oct 16, 2012·2 cites·5 claims
- 1561US6649534B2Methods for processing a coating film and for manufacturing a semiconductor elementTOKYO OHKA KOGYO CO LTD·Filed 2002·Granted Nov 18, 2003·5 cites·9 claims
- 1658US10094024B2Method of manufacturing multilayer body, method of processing substrate, and multilayer bodyFUJII YASUSHI·Filed 2012·Granted Oct 9, 2018·1 cites·7 claims
- 1754US8786089B2Manufacturing method of semiconductor device, semiconductor device and electronic apparatusWATANABE KAZUTO·Filed 2012·Granted Jul 22, 2014·1 cites·8 claims
- 1853US7338897B2Method of fabricating a semiconductor device having metal wiringROHM CO LTD·Filed 2004·Granted Mar 4, 2008·4 cites·9 claims
- 1951US2024069047A1Automated sample analyzerBECKMAN COULTER INC·Filed 2021·Application pending·0 cites
- 2047US6995096B2Method for forming multi-layer wiring structureTOKYO OHKA KOGYO CO LTD·Filed 2004·Granted Feb 7, 2006·1 cites·1 claims
- 2146US7172965B2Method for manufacturing semiconductor deviceROHM CO LTD·Filed 2004·Granted Feb 6, 2007·3 cites·19 claims
- 2245US2015010724A1Fluorocarbon, method for preparing fluorocarbon, and use thereofTOKYO OHKA KOGYO CO LTD·Filed 2014·Application pending·0 cites
- 2344US2020264207A1Substance dispense system for biological sample analysis instrumentBECKMAN COULTER INC·Filed 2018·Application pending·0 cites
- 2444US2004168927A1Electroconductive structure and electroplating method using the structureFiled 2002·Application pending·0 cites
- 2542US6723633B2Method for forming multi-layer wiring structureTOKYO OHKA KOGYO CO LTD·Filed 2002·Granted Apr 20, 2004·0 cites·1 claims
- 2642US6067930ACoaxial plasma processing apparatusTOKYO OHKA KOGYO CO LTD·Filed 1992·Granted May 30, 2000·13 cites·18 claims
- 2740US2005199586A1Resist removal method and semiconductor device manufactured by using the sameSEMICONDUCTOR LEADING EDGE TEC·Filed 2005·Application pending·0 cites
- 2834US2011265815A1Method of cleaning support plateTOKYO OHKA KOGYO CO LTD·Filed 2011·Application pending·0 cites
- 2933US6758222B2Processing method for substrateTOKYO OHKA KOGYO CO LTD·Filed 2002·Granted Jul 6, 2004·0 cites·5 claims
- 3030US6503825B1Method for forming multi-layer wiring structureTOKYO OHKA KOGYO LTD·Filed 1998·Granted Jan 7, 2003·2 cites·3 claims
- 3126US11078662B2Structure for mounting louver panelNIPPON STEEL COATED SHEET CORP·Filed 2018·Granted Aug 3, 2021·0 cites·6 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →