Inventor · disambiguated record
Jennifer O'Loughlin
Also filed as: O'LOUGHLIN JENNIFER · O'LOUGHLIN JENNIFER L
15 granted patents·3 pending applications·843 citations·filing 2000–2017
94Inventor score
Top patents by PatentIndex Score
18 records- 0198US9399228B2Method and apparatus for purging and plasma suppression in a process chamberNOVELLUS SYSTEMS INC·Filed 2013·Granted Jul 26, 2016·428 cites·8 claims
- 0298US7648899B1Interfacial layers for electromigration resistance improvement in damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2008·Granted Jan 19, 2010·78 cites·27 claims
- 0397US7858510B1Interfacial layers for electromigration resistance improvement in damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2010·Granted Dec 28, 2010·50 cites·22 claims
- 0495US6479028B1Rapid synthesis of carbon nanotubes and carbon encapsulated metal nanoparticles by a displacement reactionUNIV CALIFORNIA·Filed 2000·Granted Nov 12, 2002·108 cites·17 claims
- 0594US8741394B2In-situ deposition of film stacksHAVERKAMP JASON·Filed 2010·Granted Jun 3, 2014·25 cites·12 claims
- 0694US8217513B2Remote plasma processing of interface surfacesANTONELLI GEORGE ANDREW·Filed 2011·Granted Jul 10, 2012·24 cites·19 claims
- 0794US8084339B2Remote plasma processing of interface surfacesANTONELLI GEORGE ANDREW·Filed 2009·Granted Dec 27, 2011·29 cites·16 claims
- 0893US8709551B2Smooth silicon-containing filmsFOX KEITH·Filed 2010·Granted Apr 29, 2014·25 cites·23 claims
- 0989US8268722B2Interfacial capping layers for interconnectsYU JENGYI·Filed 2010·Granted Sep 18, 2012·13 cites·23 claims
- 1089US6713873B1Adhesion between dielectric materialsINTEL CORP·Filed 2002·Granted Mar 30, 2004·49 cites·3 claims
- 1187US9631276B2Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer depositionLAM RES CORP·Filed 2015·Granted Apr 25, 2017·2 cites·13 claims
- 1285US9028924B2In-situ deposition of film stacksNOVELLUS SYSTEMS INC·Filed 2012·Granted May 12, 2015·7 cites·14 claims
- 1357US7223705B2Ambient gas treatment of porous dielectricINTEL CORP·Filed 2003·Granted May 29, 2007·5 cites·21 claims
- 1455US10323323B2Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer depositionLAM RES CORP·Filed 2017·Granted Jun 18, 2019·0 cites·13 claims
- 1540US6645877B2Method of operating a processing chamber having multiple stationsINTEL CORP·Filed 2002·Granted Nov 11, 2003·0 cites·25 claims
- 1640US2013157466A1Silicon nitride films for semiconductor device applicationsFOX KEITH·Filed 2013·Application pending·0 cites
- 1739US2004101667A1Adhesion between dielectric materialsFiled 2003·Application pending·0 cites
- 1837US2012142172A1Pecvd deposition of smooth polysilicon filmsFOX KEITH·Filed 2011·Application pending·0 cites
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