Inventor · disambiguated record
Hsiao-Yen Lee
Also filed as: LEE HSIAO-YEN
3 granted patents·1 pending application·1 citations·filing 2013–2021
46Inventor score
Top patents by PatentIndex Score
4 records- 0178US11769712B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Sep 26, 2023·1 cites·11 claims
- 0249US11806710B2Semiconductor package structures and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 7, 2023·0 cites·20 claims
- 0344US9204557B2Environmental sensitive electronic device package and manufacturing method thereofIND TECH RES INST·Filed 2013·Granted Dec 1, 2015·0 cites·30 claims
- 0432US2018122749A1Semiconductor wafer, semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →