Inventor · disambiguated record
Byeongmoon Lee
Also filed as: LEE BYEONGMOON
10 granted patents·3 citations·filing 2017–2022
78Inventor score
Top patents by PatentIndex Score
10 records- 0190US12056305B2Pressure sensor, pressure sensor pixel array including pressure sensor, and electronic system including pressure sensorSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 6, 2024·3 cites·17 claims
- 0266US11856691B2Stretchable sensor and method of manufacturing the same and wearable deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 0364US11134566B2Apparatus for fabricating stretchable electrical circuitSEOUL NAT UNIV R&DB FOUNDATION·Filed 2020·Granted Sep 28, 2021·0 cites·8 claims
- 0463US11787966B2Paste manufacturing method and flexible electrode manufacturing method using the sameKOREA INST SCI & TECH·Filed 2022·Granted Oct 17, 2023·0 cites·7 claims
- 0561US11284509B2Method for forming flexible substrate including via, and flexible substrate having viaSEOUL NAT UNIV R&DB FOUNDATION·Filed 2020·Granted Mar 22, 2022·0 cites·5 claims
- 0659US11848303B2Electronic device and method of transferring electronic element using stamping and magnetic field alignmentSEOUL NAT UNIV R&DB FOUNDATION·Filed 2022·Granted Dec 19, 2023·0 cites·9 claims
- 0757US12297101B2Stretchable substrate and method of manufacturing the sameKOREA INST SCI & TECH·Filed 2021·Granted May 13, 2025·0 cites·5 claims
- 0853US12009339B2Electronic device and method of transferring electronic element using stamping and magnetic field alignmentSEOUL NAT UNIV R&DB FOUNDATION·Filed 2020·Granted Jun 11, 2024·0 cites·4 claims
- 0953US10757803B2Method of fabricating stretchable electrical circuitSEOUL NAT UNIV R&DB FOUNDATION·Filed 2017·Granted Aug 25, 2020·0 cites·12 claims
- 1048US10905002B2Method for forming flexible substrate including via, and flexible substrate having viaSEOUL NAT UNIV R&DB FOUNDATION·Filed 2017·Granted Jan 26, 2021·0 cites·9 claims
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