Inventor · disambiguated record
Eric Woolsey
Also filed as: WOOLSEY ERIC · WOOLSEY ERIC J · WOOLSEY ERIC JEFFERY · WOOLSEY II ERIC JEFFERY
10 granted patents·3 pending applications·260 citations·filing 1995–2019
88Inventor score
Files withMOTOROLA INC3SEMICONDUCTOR COMPONENTS IND LLC3GRUENHAGEN MICHAEL2LANG DENNIS2FAIRCHILD SEMICONDUCTOR1
Top patents by PatentIndex Score
13 records- 0195US5773359AInterconnect system and method of fabricationMOTOROLA INC·Filed 1995·Granted Jun 30, 1998·219 cites·11 claims
- 0284US10818587B2Semiconductor device and method of forming a curved image sensorSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Oct 27, 2020·1 cites·20 claims
- 0377US8722528B2Die backside standoff structures for semiconductor devicesGRUENHAGEN MICHAEL·Filed 2012·Granted May 13, 2014·6 cites·20 claims
- 0476US6413878B1Method of manufacturing electronic componentsMOTOROLA INC·Filed 2000·Granted Jul 2, 2002·12 cites·11 claims
- 0575US11605576B2Via for semiconductor devices and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Mar 14, 2023·2 cites·20 claims
- 0672US7655539B2Dice by grind for back surface metallized diesFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Feb 2, 2010·4 cites·23 claims
- 0766US10115662B2Semiconductor device and method of forming a curved image sensorSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Oct 30, 2018·0 cites·20 claims
- 0865US6436300B2Method of manufacturing electronic componentsMOTOROLA INC·Filed 1998·Granted Aug 20, 2002·16 cites·8 claims
- 0949US11127018B2Secure access-based resource delegationNCR CORP·Filed 2017·Granted Sep 21, 2021·0 cites·7 claims
- 1047US2010081257A1Dice by grind for back surface metallized diesHENDRICKS CRAIG W·Filed 2009·Application pending·0 cites
- 1142US2008054461A1Reliable wafer-level chip-scale package solder bump structure in a packaged semiconductor deviceLANG DENNIS·Filed 2007·Application pending·0 cites
- 1241US8314473B2Die backside standoff structures for semiconductor devicesGRUENHAGEN MICHAEL·Filed 2010·Granted Nov 20, 2012·0 cites·19 claims
- 1334US2010117231A1Reliable wafer-level chip-scale solder bump structureLANG DENNIS·Filed 2010·Application pending·0 cites
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