Inventor · disambiguated record
Darin Miller
Also filed as: MILLER DARIN · MILLER DARIN S
5 granted patents·68 citations·filing 2003–2022
75Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0193US8962482B2Multi-layer interconnect with isolation layerALBERTSON TODD·Filed 2006·Granted Feb 24, 2015·64 cites·10 claims
- 0264US12463129B2Conductive interconnects and methods of forming conductive interconnectsMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 4, 2025·0 cites·21 claims
- 0363US7642651B2Multi-layer interconnect with isolation layerMICRON TECHNOLOGY INC·Filed 2006·Granted Jan 5, 2010·2 cites·21 claims
- 0457US11545391B2Conductive interconnects and methods of forming conductive interconnectsMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 3, 2023·0 cites·58 claims
- 0547US7375033B2Multi-layer interconnect with isolation layerMICRON TECHNOLOGY INC·Filed 2003·Granted May 20, 2008·2 cites·35 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →