Inventor · disambiguated record
Yu-Sin Yang
Also filed as: YANG YU SIN
66 granted patents·17 pending applications·198 citations·filing 2001–2020
98Inventor score
Top patents by PatentIndex Score
83 records- 0190US11037283B2Inspecting apparatus based on hyperspectral imagingSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 15, 2021·7 cites·17 claims
- 0287US10001444B2Surface inspecting methodSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 19, 2018·4 cites·19 claims
- 0387US9733178B2Spectral ellipsometry measurement and data analysis device and related systems and methodsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 15, 2017·3 cites·16 claims
- 0487US9659743B2Image creating method and imaging system for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted May 23, 2017·4 cites·20 claims
- 0586US7186280B2Method of inspecting a leakage current characteristic of a dielectric layer and apparatus for performing the methodSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 6, 2007·14 cites·17 claims
- 0684US9036895B2Method of inspecting waferSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 19, 2015·6 cites·20 claims
- 0783US9934939B2Scanning electron microscope system capable of measuring in-cell overlay offset using high-energy electron beam and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 3, 2018·5 cites·13 claims
- 0883US9831626B2Broadband light source and optical inspector having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 28, 2017·2 cites·17 claims
- 0982US8126258B2Method of detecting defects in patterns on semiconductor substrate by comparing second image with reference image after acquiring second image from first image and apparatus for performing the sameYANG YU-SIN·Filed 2007·Granted Feb 28, 2012·9 cites·12 claims
- 1082US8050488B2Method of analyzing a wafer sampleSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 1, 2011·6 cites·12 claims
- 1181US11043433B2Method of inspecting surface and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 22, 2021·1 cites·26 claims
- 1281US10249544B2Method of inspecting surface and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 2, 2019·2 cites·20 claims
- 1381US8841824B2Broadband light illuminatorsSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Sep 23, 2014·5 cites·20 claims
- 1479US9123503B2Methods of fabricating microelectronic substrate inspection equipmentSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 1, 2015·3 cites·9 claims
- 1579US8034640B2Apparatus and method to inspect defect of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 11, 2011·5 cites·19 claims
- 1679US8034641B2Method for inspection of defects on a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Oct 11, 2011·5 cites·20 claims
- 1779US7428328B2Method of forming a three-dimensional image of a pattern to be inspected and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 23, 2008·7 cites·27 claims
- 1877US9261532B1Conductive atomic force microscope and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 16, 2016·2 cites·20 claims
- 1977US7486392B2Method of inspecting for defects and apparatus for performing the methodSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 3, 2009·6 cites·11 claims
- 2074US7426031B2Method and apparatus for inspecting target defects on a waferSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 16, 2008·4 cites·21 claims
- 2173US10593032B2Defect inspection method and defect inspection apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 17, 2020·1 cites·18 claims
- 2273US10373796B2Method of inspecting wafer using electron beamSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 6, 2019·2 cites·20 claims
- 2373US9455206B2Overlay measuring method and system, and method of manufacturing semiconductor device using the sameYUN SEONG-JIN·Filed 2015·Granted Sep 27, 2016·2 cites·10 claims
- 2473US7385689B2Method and apparatus for inspecting substrate patternSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 10, 2008·5 cites·35 claims
- 2572US8703405B2Methods of generating three-dimensional process window qualificationSOHN YOUNG-HOON·Filed 2012·Granted Apr 22, 2014·2 cites·20 claims
- 2672US6803241B2Method of monitoring contact hole of integrated circuit using corona chargesSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Oct 12, 2004·19 cites·8 claims
- 2771US10559506B2Method of inspecting semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 11, 2020·2 cites·20 claims
- 2870US8055056B2Method of detecting defects of patterns on a semiconductor substrate and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 8, 2011·3 cites·14 claims
- 2970US7804591B2Wafer inspecting methodSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 28, 2010·3 cites·12 claims
- 3069US7446865B2Method of classifying defectsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 4, 2008·3 cites·17 claims
- 3168US7697130B2Apparatus and method for inspecting a surface of a waferSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Apr 13, 2010·3 cites·17 claims
- 3267US8729468B2Microelectronic substrate inspection equipment using helium ion microscopyKIM MIN-KOOK·Filed 2012·Granted May 20, 2014·2 cites·11 claims
- 3367US7394279B2Method of measuring a surface voltage of an insulating layerSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 1, 2008·4 cites·15 claims
- 3466US8902412B2Defect inspection apparatus and defect inspection method using the sameSOHN YOUNG-HOON·Filed 2012·Granted Dec 2, 2014·1 cites·19 claims
- 3566US7433032B2Method and apparatus for inspecting defects in multiple regions with different parametersSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 7, 2008·2 cites·24 claims
- 3665US8055057B2Method for detecting defects in a substrate having a semiconductor device thereonSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 8, 2011·2 cites·14 claims
- 3765US6650408B2Method for inspecting a polishing pad in a semiconductor manufacturing process, an apparatus for performing the method, and a polishing device adopting the apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Nov 18, 2003·12 cites·19 claims
- 3864US6911662B2Chemical-mechanical polishing apparatus and method for controlling the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 28, 2005·10 cites·12 claims
- 3963US8759763B2Method and apparatus to measure step height of device using scanning electron microscopeSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Jun 24, 2014·1 cites·19 claims
- 4063US8184899B2Method of detecting a defect on an objectYANG YU-SIN·Filed 2009·Granted May 22, 2012·3 cites·15 claims
- 4157US2019214316A1Method of inspecting surface and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 4256US2021026152A1Multilayer structure inspection apparatus and method, and semiconductor device fabricating method using the inspection methodSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 4352US10969428B2Method of inspecting pattern defectSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 6, 2021·0 cites·14 claims
- 4452US10222414B2Apparatus and method for exchanging probeSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 5, 2019·0 cites·20 claims
- 4552US9255694B2Reflector structure of illumination optic systemSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 9, 2016·0 cites·14 claims
- 4652US6927077B2Method and apparatus for measuring contamination of a semiconductor substrateSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 9, 2005·4 cites·21 claims
- 4749US7271890B2Method and apparatus for inspecting defectsSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 18, 2007·2 cites·19 claims
- 4849US7113274B2Method and apparatus for inspecting a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 26, 2006·2 cites·20 claims
- 4949US2019137776A1Methods of manufacturing vertical semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
- 5048US11181831B2Methods of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 23, 2021·0 cites·20 claims
Showing the top 50 of 83 patent records by PatentIndex Score.
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