Inventor · disambiguated record

Oswin Ehrmann

Also filed as: EHRMANN OSWIN

1 granted patent·0 citations·filing 2017–2017

6Inventor score

Technology areasH10P

Files withFRAUNHOFER GES FORSCHUNG1

Top patents by PatentIndex Score

1 record

0134US10074608B2Method for manufacturing a contact bump by thermal expansion of a patterned sacrificial layer underneath a galvanic layerFRAUNHOFER GES FORSCHUNG·Filed 2017·Granted Sep 11, 2018·0 cites·13 claims

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