Inventor · disambiguated record
Akira Oga
Also filed as: OGA AKIRA
19 granted patents·5 pending applications·502 citations·filing 1996–2019
93Inventor score
Files withDENSO CORP9MATSUSHITA ELECTRIC INDUSTRIAL CO LTD5PANASONIC CORP4MATSUSHITA ELECTRONICS CORP3DENSO INT AMERICA INC1
Top patents by PatentIndex Score
24 records- 0197US6225146B1Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor deviceMATSUSHITA ELECTRONICS CORP·Filed 1999·Granted May 1, 2001·247 cites·20 claims
- 0294US5977615ALead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor deviceMATSUSHITA ELECTRONICS CORP·Filed 1997·Granted Nov 2, 1999·159 cites·27 claims
- 0383US6984880B2Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jan 10, 2006·34 cites·4 claims
- 0474US6720207B2Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 13, 2004·21 cites·28 claims
- 0572US10214125B2Air-circulation promotion apparatus for vehicleDENSO CORP·Filed 2013·Granted Feb 26, 2019·3 cites·20 claims
- 0671US10675944B2Vehicular air conditionerDENSO CORP·Filed 2016·Granted Jun 9, 2020·1 cites·10 claims
- 0766US10493822B2Radiant heater deviceDENSO CORP·Filed 2014·Granted Dec 3, 2019·1 cites·14 claims
- 0863US7508055B2High heat release semiconductor and method for manufacturing the samePANASONIC CORP·Filed 2005·Granted Mar 24, 2009·4 cites·23 claims
- 0961US10004111B2In-vehicle radiant heater control apparatusDENSO CORP·Filed 2014·Granted Jun 19, 2018·1 cites·11 claims
- 1059US6645792B2Lead frame and method for fabricating resin-encapsulated semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 11, 2003·10 cites·6 claims
- 1157US7246657B2Air conditioner for vehicleDENSO CORP·Filed 2004·Granted Jul 24, 2007·8 cites·9 claims
- 1251US10894460B2Occupant detection systemDENSO CORP·Filed 2019·Granted Jan 19, 2021·0 cites·8 claims
- 1351US10703168B2Occupant detection system, and vehicular air conditioner having the sameDENSO CORP·Filed 2016·Granted Jul 7, 2020·0 cites·22 claims
- 1451US7668686B2External temperature display control algorithmDENSO INT AMERICA INC·Filed 2007·Granted Feb 23, 2010·3 cites·17 claims
- 1550US2008246129A1Method of manufacturing semiconductor device and semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 1648US8039932B2Lead frame, semiconductor device, method of manufacturing the lead frame, and method of manufacturing the semiconductor devicePANASONIC CORP·Filed 2008·Granted Oct 18, 2011·0 cites·20 claims
- 1745US10618375B2Vehicular air-conditionerDENSO CORP·Filed 2016·Granted Apr 14, 2020·0 cites·7 claims
- 1845US2011151622A1Method of manufacturing semiconductor devicePANASONIC CORP·Filed 2011·Application pending·0 cites
- 1942US5708295ALead frame and method of manufacturing the same, and resin sealed semiconductor device and method of manufacturing the sameMATSUSHITA ELECTRONICS CORP·Filed 1996·Granted Jan 13, 1998·10 cites·16 claims
- 2041US2006049508A1Semiconductor device, lead frame, and methods for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 2140US2012038033A1Semiconductor deviceOGA AKIRA·Filed 2011·Application pending·0 cites
- 2237US2007262409A1Lead frame and semiconductor device using the sameNOZAKI YOICHIRO·Filed 2007·Application pending·0 cites
- 2336US10434840B2Control system for radiant heating deviceDENSO CORP·Filed 2015·Granted Oct 8, 2019·0 cites·11 claims
- 2427USD600219SLead framePANASONIC CORP·Filed 2006·Granted Sep 15, 2009·0 cites·1 claims
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