Inventor · disambiguated record
Yoshikazu Sakano
Also filed as: SAKANO YOSHIKAZU
5 granted patents·2 pending applications·378 citations·filing 1993–2007
86Inventor score
Top patents by PatentIndex Score
7 records- 0195US6521538B2Method of forming a trench with a rounded bottom in a semiconductor deviceDENSO CORP·Filed 2001·Granted Feb 18, 2003·127 cites·26 claims
- 0287US6090718ADry etching method for semiconductor substrateDENSO CORP·Filed 1997·Granted Jul 18, 2000·96 cites·44 claims
- 0381US5423941ADry etching process for semiconductorNIPPON DENSO CO·Filed 1993·Granted Jun 13, 1995·86 cites·7 claims
- 0465US5871659ADry etching process for semiconductorNIPPON DENSO CO·Filed 1996·Granted Feb 16, 1999·31 cites·18 claims
- 0564US5522966ADry etching process for semiconductorNIPPON DENSO CO·Filed 1993·Granted Jun 4, 1996·38 cites·5 claims
- 0646US2007227100A1Wrapping device and wrapping method using the wrapping deviceORIENT INSTR COMP CO LTD·Filed 2007·Application pending·0 cites
- 0740US2006053751A1Wrapping device and wrapping method using the wrapping deviceITO TOMOAKI·Filed 2004·Application pending·0 cites
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