Inventor · disambiguated record

Balasubramanian Sivagnanam

Also filed as: SIVAGNANAM BALASUBRAMANIAN

1 granted patent·1 pending application·149 citations·filing 2003–2007

55Inventor score

Technology areasH10W

Files withADVANPACK SOLUTIONS PTE LTD2

Top patents by PatentIndex Score

2 records

0189US7462942B2Die pillar structures and a method of their formationADVANPACK SOLUTIONS PTE LTD·Filed 2003·Granted Dec 9, 2008·149 cites·59 claims
0239US2008248610A1Thermal bonding process for chip packagingADVANPACK SOLUTIONS PTE LTD·Filed 2007·Application pending·0 cites

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →