Inventor · disambiguated record
Marie-France Boyaud
Also filed as: BOYAUD MARIE-FRANCE
3 granted patents·25 citations·filing 2002–2005
71Inventor score
Technology areasH10W
Files withIBM3
Top patents by PatentIndex Score
3 records- 0176US6988882B2Transfer molding of integrated circuit packagesIBM·Filed 2005·Granted Jan 24, 2006·7 cites·16 claims
- 0261US6956296B2Transfer molding of integrated circuit packagesIBM·Filed 2003·Granted Oct 18, 2005·9 cites·3 claims
- 0361US6656773B2Transfer molding of integrated circuit packagesIBM·Filed 2002·Granted Dec 2, 2003·9 cites·10 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →