Inventor · disambiguated record
Cheng Choi Yong
Also filed as: YONG CHENG · YONG CHENG CHOI
6 granted patents·5 pending applications·111 citations·filing 2001–2018
82Inventor score
Files withFREESCALE SEMICONDUCTOR INC4EU POH LENG1ISMAIL AMINUDDIN1JIANGSU ACAD AGRICULTURAL SCI1TAN LAN CHU1
Top patents by PatentIndex Score
11 records- 0195US7160755B2Method of forming a substrateless semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jan 9, 2007·58 cites·17 claims
- 0289US7626276B2Method and apparatus for providing structural support for interconnect pad while allowing signal conductanceFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Dec 1, 2009·17 cites·19 claims
- 0381US6933614B2Integrated circuit die having a copper contact and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 23, 2005·31 cites·15 claims
- 0473US7241636B2Method and apparatus for providing structural support for interconnect pad while allowing signal conductanceFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jul 10, 2007·5 cites·20 claims
- 0544US11633714B2Preparation method for combined modified straw active particulate carbon adsorption material and use of sameJIANGSU ACAD AGRICULTURAL SCI·Filed 2018·Granted Apr 25, 2023·0 cites·19 claims
- 0641US2015235981A1Wire bonding method with two step free air ball formationEU POH LENG·Filed 2014·Application pending·0 cites
- 0741US2008182120A1Bond pad for semiconductor deviceTAN LAN CHU·Filed 2007·Application pending·0 cites
- 0837US2007026573A1Method of making a stacked die packageISMAIL AMINUDDIN·Filed 2005·Application pending·0 cites
- 0935US9337167B2Wire bonding method employing two scrub settingsWONG BOH KID·Filed 2014·Granted May 10, 2016·0 cites·14 claims
- 1033US2003111720A1Stacked die semiconductor deviceFiled 2001·Application pending·0 cites
- 1132US2003230796A1Stacked die semiconductor deviceFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →