Inventor · disambiguated record
Lan Chu Tan
Also filed as: TAN LAN · TAN LAN C · TAN LAN CHU
32 granted patents·18 pending applications·306 citations·filing 2001–2020
96Inventor score
Files withFREESCALE SEMICONDUCTOR INC12FOONG CHEE SENG7LO WAI YEW6MUNIANDY KESVAKUMAR V C3NXP USA INC3
Top patents by PatentIndex Score
50 records- 0196US8669140B1Method of forming stacked die package using redistributed chip packagingMUNIANDY KESVAKUMAR V C·Filed 2013·Granted Mar 11, 2014·51 cites·20 claims
- 0294US11581241B2Circuit modules with front-side interposer terminals and through-module thermal dissipation structuresNXP USA INC·Filed 2020·Granted Feb 14, 2023·3 cites·19 claims
- 0393US8378435B2Pressure sensor and method of assembling sameLO WAI YEW·Filed 2010·Granted Feb 19, 2013·16 cites·20 claims
- 0486US9297713B2Pressure sensor device with through silicon viaLO WAI YEW·Filed 2014·Granted Mar 29, 2016·8 cites·10 claims
- 0586US7384819B2Method of forming stackable packageFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jun 10, 2008·16 cites·11 claims
- 0684US6900531B2Image sensor deviceFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted May 31, 2005·53 cites·16 claims
- 0783US7741196B2Semiconductor wafer with improved crack protectionFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jun 22, 2010·9 cites·15 claims
- 0882US9721928B1Integrated circuit package having two substratesFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Aug 1, 2017·4 cites·15 claims
- 0981US6933614B2Integrated circuit die having a copper contact and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 23, 2005·31 cites·15 claims
- 1080US9202770B1Non-homogeneous molding of packaged semiconductor devicesFOONG CHEE SENG·Filed 2014·Granted Dec 1, 2015·5 cites·9 claims
- 1180US7042098B2Bonding pad for a packaged integrated circuitFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted May 9, 2006·33 cites·18 claims
- 1277US9589928B2Combined QFN and QFP semiconductor packageBAI ZHIGANG·Filed 2014·Granted Mar 7, 2017·4 cites·19 claims
- 1377US8716846B2Pressure sensor and method of packaging sameYAO JINZHONG·Filed 2011·Granted May 6, 2014·4 cites·7 claims
- 1476US9269659B1Interposer with overmolded viasFOONG CHEE SENG·Filed 2015·Granted Feb 23, 2016·2 cites·18 claims
- 1575US11056457B2Semiconductor device with bond wire reinforcement structureNXP USA INC·Filed 2018·Granted Jul 6, 2021·2 cites·15 claims
- 1675US7160798B2Method of making reinforced semiconductor packageFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Jan 9, 2007·8 cites·16 claims
- 1769US8802474B1Pressure sensor and method of packaging sameYAO JINZHONG·Filed 2014·Granted Aug 12, 2014·2 cites·10 claims
- 1869US6693020B2Method of preparing copper metallization die for wirebondingMOTOROLA INC·Filed 2001·Granted Feb 17, 2004·21 cites·13 claims
- 1966US6563226B2Bonding padMOTOROLA INC·Filed 2001·Granted May 13, 2003·14 cites·11 claims
- 2061US9997445B2Substrate interconnections for packaged semiconductor deviceNXP USA INC·Filed 2016·Granted Jun 12, 2018·1 cites·8 claims
- 2160US9437492B2Substrate for alternative semiconductor die configurationsYOW KAI YUN·Filed 2014·Granted Sep 6, 2016·1 cites·8 claims
- 2260US7494924B2Method for forming reinforced interconnects on a substrateFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Feb 24, 2009·2 cites·9 claims
- 2360US7261230B2Wirebonding insulated wire and capillary thereforFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 28, 2007·14 cites·22 claims
- 2453US9214402B2Pressure sensor device with gel retainerFAM KEE CHEONG·Filed 2014·Granted Dec 15, 2015·2 cites·14 claims
- 2551US9474162B2Circuit substrate and method of manufacturing sameFOONG CHEE SENG·Filed 2014·Granted Oct 18, 2016·0 cites·10 claims
- 2649US9053972B1Pillar bump formed using spot-laserFOONG CHEE SENG·Filed 2013·Granted Jun 9, 2015·0 cites·9 claims
- 2747US2011084411A1Semiconductor dieFREESCALE SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 2847US2011059579A1Method of forming tape ball grid array packageFREESCALE SEMICONDUCTOR INC·Filed 2009·Application pending·0 cites
- 2946US9401345B2Semiconductor device package with organic interposerFOONG CHEE SENG·Filed 2014·Granted Jul 26, 2016·0 cites·14 claims
- 3046US7985672B2Solder ball attachment ring and method of useFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jul 26, 2011·0 cites·7 claims
- 3145US2005198314A1Method and apparatus for characterizing a network connectionFiled 2004·Application pending·0 cites
- 3244US8643189B1Packaged semiconductor die with power rail padsLOW BOON YEW·Filed 2012·Granted Feb 4, 2014·0 cites·20 claims
- 3343US9177834B2Power bar design for lead frame-based packagesFOONG CHEE SENG·Filed 2014·Granted Nov 3, 2015·0 cites·8 claims
- 3443US2015200177A1Wafer level package with redistribution layer formed with metallic powderFOONG CHEE SENG·Filed 2014·Application pending·0 cites
- 3543US2015097278A1Surface mount semiconductor device with additional bottom face contactsBAI ZHIGANG·Filed 2014·Application pending·0 cites
- 3642US2015187728A1Emiconductor device with die top power connectionsMUNIANDY KESVAKUMAR V C·Filed 2013·Application pending·0 cites
- 3742US2015054099A1Pressure sensor device and assembly methodYOW KAI YUN·Filed 2013·Application pending·0 cites
- 3842US2015069537A1Package-on-package semiconductor sensor deviceLO WAI YEW·Filed 2013·Application pending·0 cites
- 3941US2008182120A1Bond pad for semiconductor deviceTAN LAN CHU·Filed 2007·Application pending·0 cites
- 4041US2006231959A1Bonding pad for a packaged integrated circuitHARUN FUAIDA·Filed 2006·Application pending·0 cites
- 4140US8853058B2Method of making surface mount stacked semiconductor devicesMUNIANDY KESVAKUMAR V C·Filed 2012·Granted Oct 7, 2014·0 cites·20 claims
- 4239US9165904B1Insulated wire bonding with EFO before second bondSIONG CHIN TECK·Filed 2014·Granted Oct 20, 2015·0 cites·14 claims
- 4339US2012139067A1Pressure sensor and method of packaging sameLO WAI YEW·Filed 2011·Application pending·0 cites
- 4439US2012306031A1Semiconductor sensor device and method of packaging sameLO WAI YEW·Filed 2011·Application pending·0 cites
- 4537US2016071789A1Molded interposer for packaged semiconductor deviceTONG PEI FAN·Filed 2014·Application pending·0 cites
- 4635US2007281393A1Method of forming a trace embedded packageGAUTHAM VISWANADAM·Filed 2006·Application pending·0 cites
- 4734US2012073859A1Polymer core wireLO WAI YEW·Filed 2010·Application pending·0 cites
- 4833US2004065933A1Flip chip optical and imaging sensor deviceFiled 2002·Application pending·0 cites
- 4933US2003111720A1Stacked die semiconductor deviceFiled 2001·Application pending·0 cites
- 5032US2003230796A1Stacked die semiconductor deviceFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →