Inventor · disambiguated record
Cuiming Du
Also filed as: DU CUIMING
5 granted patents·1 pending application·1 citations·filing 2011–2019
61Inventor score
Top patents by PatentIndex Score
6 records- 0181US11053352B2Vinyl thermosetting resin composition, prepreg, laminate, and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2019·Granted Jul 6, 2021·1 cites·17 claims
- 0261US11261305B2Thermosetting resin composition, prepreg, laminate, and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2019·Granted Mar 1, 2022·0 cites·17 claims
- 0357US10053547B2Thermosetting resin composition and uses thereofSHENGYI TECHNOLOGY CO LTD·Filed 2013·Granted Aug 21, 2018·0 cites·19 claims
- 0447US10208188B2Thermosetting resin composition and uses thereofSHENGYI TECHNOLOGY CO LTD·Filed 2013·Granted Feb 19, 2019·0 cites·17 claims
- 0536US2018346675A1Thermosetting resin composition, prepreg containing same, laminated board, and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2016·Application pending·0 cites
- 0632US9475970B2Epoxy resin composition and copper clad laminate manufactured by using sameDU CUIMING·Filed 2011·Granted Oct 25, 2016·0 cites·5 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →