Inventor · disambiguated record
Ga Hyun No
Also filed as: NO GA HYUN
3 granted patents·14 citations·filing 2014–2018
61Inventor score
Technology areasH10W
Files withSK HYNIX INC3
Top patents by PatentIndex Score
3 records- 0187US9437580B1Semiconductor packages with metal posts, memory cards including the same, and electronic systems including the sameSK HYNIX INC·Filed 2015·Granted Sep 6, 2016·11 cites·14 claims
- 0275US10497671B2Semiconductor packages including chip stacksSK HYNIX INC·Filed 2018·Granted Dec 3, 2019·3 cites·6 claims
- 0349US9412690B2Package substrates, packages including the same, methods of fabricating the packages with the package substrates, electronic systems including the packages, and memory cards including the packagesSK HYNIX INC·Filed 2014·Granted Aug 9, 2016·0 cites·9 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →