Inventor · disambiguated record
Akio Rokugawa
Also filed as: ROKUGAWA AKIO
57 granted patents·4 pending applications·985 citations·filing 1986–2021
99Inventor score
Files withSHINKO ELECTRIC IND CO54SHIMIZU NORIYOSHI2DENKI KAGAKU KOGYO KK1FUJITSU LTD1KISHII SADAHIRO1
Top patents by PatentIndex Score
61 records- 0198US6418615B1Method of making multilayered substrate for semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2000·Granted Jul 16, 2002·164 cites·21 claims
- 0297US9875957B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2015·Granted Jan 23, 2018·27 cites·8 claims
- 0397US6441314B2Multilayered substrate for semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2001·Granted Aug 27, 2002·80 cites·13 claims
- 0494US8288875B2Method of manufacturing a semiconductor package and semiconductor package having an electrode pad with a small pitchSHIMIZU NORIYOSHI·Filed 2010·Granted Oct 16, 2012·20 cites·9 claims
- 0593US9820391B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2015·Granted Nov 14, 2017·11 cites·17 claims
- 0693US9520352B2Wiring board and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2015·Granted Dec 13, 2016·11 cites·9 claims
- 0793US7536780B2Method of manufacturing wiring substrate to which semiconductor chip is mountedSHINKO ELECTRIC IND CO·Filed 2005·Granted May 26, 2009·30 cites·8 claims
- 0893US7335531B2Semiconductor device package and method of production and semiconductor device of sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Feb 26, 2008·21 cites·10 claims
- 0993US6914322B2Semiconductor device package and method of production and semiconductor device of sameSHINKO ELECTRIC IND CO·Filed 2002·Granted Jul 5, 2005·50 cites·9 claims
- 1093US4721878ACharged particle emission source structureDENKI KAGAKU KOGYO KK·Filed 1986·Granted Jan 26, 1988·87 cites·20 claims
- 1191US9620446B2Wiring board, electronic component device, and method for manufacturing thoseSHINKO ELECTRIC IND CO·Filed 2015·Granted Apr 11, 2017·7 cites·9 claims
- 1291US6931724B2Insulated multilayered substrate having connecting leads for mounting a semiconductor element thereonSHINKO ELECTRIC IND CO·Filed 2002·Granted Aug 23, 2005·35 cites·17 claims
- 1390US9167692B2Wiring board, semiconductor device, and method of manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2014·Granted Oct 20, 2015·11 cites·12 claims
- 1489US10028393B2Wiring substrate and semiconductor packageSHINKO ELECTRIC IND CO·Filed 2015·Granted Jul 17, 2018·8 cites·7 claims
- 1589US6921977B2Semiconductor package, method of production of same, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2003·Granted Jul 26, 2005·36 cites·10 claims
- 1689US6764931B2Semiconductor package, method of manufacturing the same, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2002·Granted Jul 20, 2004·41 cites·5 claims
- 1787US9000302B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2014·Granted Apr 7, 2015·8 cites·10 claims
- 1887US8994193B2Semiconductor package including a metal plate, semiconductor chip, and wiring structure, semiconductor apparatus and method for manufacturing semiconductor packageSHINKO ELECTRIC IND CO·Filed 2013·Granted Mar 31, 2015·9 cites·11 claims
- 1986US7314780B2Semiconductor package, method of production of same, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2005·Granted Jan 1, 2008·12 cites·3 claims
- 2085US9455219B2Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2013·Granted Sep 27, 2016·8 cites·5 claims
- 2185US9220167B2Wiring substrate, semiconductor device, and method of manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Dec 22, 2015·5 cites·10 claims
- 2285US8823187B2Semiconductor package, semiconductor package manufacturing method and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2012·Granted Sep 2, 2014·7 cites·9 claims
- 2385US7352060B2Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrateSHINKO ELECTRIC IND CO·Filed 2005·Granted Apr 1, 2008·13 cites·14 claims
- 2485US7078269B2Substrate fabrication method and substrateSHINKO ELECTRIC IND CO·Filed 2004·Granted Jul 18, 2006·33 cites·6 claims
- 2583US8581421B2Semiconductor package manufacturing method and semiconductor packageSHIMIZU NORIYOSHI·Filed 2011·Granted Nov 12, 2013·7 cites·17 claims
- 2683US7033934B2Method of production of semiconductor packageSHINKO ELECTRIC IND CO·Filed 2003·Granted Apr 25, 2006·24 cites·6 claims
- 2782US9257386B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Feb 9, 2016·6 cites·16 claims
- 2880US9119319B2Wiring board, semiconductor device, and method for manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2014·Granted Aug 25, 2015·6 cites·10 claims
- 2980US6783652B2Process for manufacturing a wiring boardSHINKO ELECTRIC IND CO·Filed 2001·Granted Aug 31, 2004·28 cites·14 claims
- 3079US6828224B2Method of fabricating substrate utilizing an electrophoretic deposition processSHINKO ELECTRIC IND CO·Filed 2002·Granted Dec 7, 2004·23 cites·8 claims
- 3177US6340841B2Build-up board package for semiconductor devicesSHINKO ELECTRIC IND CO·Filed 2000·Granted Jan 22, 2002·21 cites·9 claims
- 3274US6754952B2Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporatedSHINKO ELECTRIC IND CO·Filed 2002·Granted Jun 29, 2004·21 cites·6 claims
- 3373US9735098B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Aug 15, 2017·2 cites·7 claims
- 3472US10366949B2Wiring substrate and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2018·Granted Jul 30, 2019·1 cites·12 claims
- 3571US7358114B2Semiconductor device substrate, semiconductor device, and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2005·Granted Apr 15, 2008·4 cites·9 claims
- 3669US7019404B2Multilayered circuit substrate, semiconductor device and method of producing sameSHINKO ELECTRIC IND CO·Filed 2003·Granted Mar 28, 2006·11 cites·10 claims
- 3768US9565775B2Wiring board, semiconductor device, and method of manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2014·Granted Feb 7, 2017·2 cites·13 claims
- 3868US6979854B2Thin-film capacitor device, mounting module for the same, and method for fabricating the sameSHINKO ELECTRIC IND CO·Filed 2003·Granted Dec 27, 2005·13 cites·6 claims
- 3968US6434819B1Production of multilayer circuit boardSHINKO ELECTRIC IND CO·Filed 1999·Granted Aug 20, 2002·28 cites·17 claims
- 4067US8399295B2Semiconductor device and its manufacture methodKISHII SADAHIRO·Filed 2011·Granted Mar 19, 2013·3 cites·9 claims
- 4166US7250355B2Multilayered circuit substrate, semiconductor device and method of producing sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Jul 31, 2007·2 cites·6 claims
- 4263US10978383B2Wiring board and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2015·Granted Apr 13, 2021·1 cites·20 claims
- 4362US11430725B2Wiring board and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2021·Granted Aug 30, 2022·0 cites·16 claims
- 4461US7161242B2Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor elementSHINKO ELECTRIC IND CO·Filed 2004·Granted Jan 9, 2007·10 cites·18 claims
- 4561US6999299B2Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring boardSHINKO ELECTRIC IND CO·Filed 2004·Granted Feb 14, 2006·10 cites·6 claims
- 4661US6884655B2Semiconductor package, method of manufacturing the same, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2004·Granted Apr 26, 2005·17 cites·4 claims
- 4760US7763809B2Multilayered substrate for semiconductor device and method of manufacturing sameSHINKO ELECTRIC IND CO·Filed 2004·Granted Jul 27, 2010·5 cites·12 claims
- 4854US7115931B2Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2004·Granted Oct 3, 2006·3 cites·14 claims
- 4952US8785256B2Method of manufacturing semiconductor packageSHINKO ELECTRIC IND CO·Filed 2013·Granted Jul 22, 2014·0 cites·13 claims
- 5051US8791561B2Semiconductor device and its manufacture methodFUJITSU LTD·Filed 2013·Granted Jul 29, 2014·0 cites·6 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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