Inventor · disambiguated record
Pingliang Tu
Also filed as: TU PINGLIANG
2 granted patents·2 pending applications·2 citations·filing 2010–2019
35Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0161US10399170B2Die attachment apparatus and method utilizing activated forming gasLAM KUI KAM·Filed 2013·Granted Sep 3, 2019·2 cites·18 claims
- 0242US10861714B2Heating of a substrate for epoxy depositionASM TECH SINGAPORE PTE LTD·Filed 2019·Granted Dec 8, 2020·0 cites·13 claims
- 0340US2013119113A1System for dispensing soft solder for mounting semiconductor chips using multiple solder wiresLAM KUI KAM·Filed 2013·Application pending·0 cites
- 0435US2011272452A1System for dispensing soft solder for mounting semiconductor chips using multiple solder wiresLAM KUI KAM·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →