Inventor · disambiguated record
Dustin P. Wood
Also filed as: WOOD DUSTIN · WOOD DUSTIN P
29 granted patents·3 pending applications·229 citations·filing 1999–2019
96Inventor score
Top patents by PatentIndex Score
32 records- 0194US7355836B2Array capacitor for decoupling multiple voltage railsINTEL CORP·Filed 2005·Granted Apr 8, 2008·37 cites·30 claims
- 0288US6819543B2Multilayer capacitor with multiple plates per layerINTEL CORP·Filed 2002·Granted Nov 16, 2004·71 cites·18 claims
- 0384US7375412B1iTFC with optimized C(T)INTEL CORP·Filed 2005·Granted May 20, 2008·10 cites·15 claims
- 0478US7667320B2Integrated circuit package with improved power signal connectionINTEL CORP·Filed 2008·Granted Feb 23, 2010·5 cites·3 claims
- 0574US7463492B2Array capacitors with voids to enable a full-grid socketINTEL CORP·Filed 2007·Granted Dec 9, 2008·6 cites·18 claims
- 0674US6501166B2Stitched plane structure and process for package power delivery and dual referenced stripline I/O performanceINTEL CORP·Filed 2000·Granted Dec 31, 2002·19 cites·18 claims
- 0770US7687905B2Integrated circuit packages, systems, and methodsINTEL CORP·Filed 2008·Granted Mar 30, 2010·4 cites·6 claims
- 0867US6979891B2Integrated circuit packaging architectureINTEL CORP·Filed 2003·Granted Dec 27, 2005·12 cites·14 claims
- 0966US7321172B2Selective plating of package terminalsINTEL CORP·Filed 2005·Granted Jan 22, 2008·2 cites·3 claims
- 1063US6429051B1Stitched plane structure for package power delivery and dual referenced stripline I/O performanceINTEL CORP·Filed 2001·Granted Aug 6, 2002·10 cites·9 claims
- 1160US7755165B2iTFC with optimized C(T)INTEL CORP·Filed 2008·Granted Jul 13, 2010·1 cites·19 claims
- 1260US6225687B1Chip package with degassing holesINTEL CORP·Filed 1999·Granted May 1, 2001·16 cites·29 claims
- 1359US7173804B2Array capacitor with IC contacts and applicationsINTEL CORP·Filed 2004·Granted Feb 6, 2007·9 cites·17 claims
- 1458US7183644B2Integrated circuit package with improved power signal connectionINTEL CORP·Filed 2004·Granted Feb 27, 2007·5 cites·3 claims
- 1556US10522455B2Integrated circuit package substrateINTEL CORP·Filed 2019·Granted Dec 31, 2019·0 cites·3 claims
- 1656US6831233B2Chip package with degassing holesINTEL CORP·Filed 2001·Granted Dec 14, 2004·4 cites·3 claims
- 1754US7348214B2Integrated circuit package with improved power signal connectionINTEL CORP·Filed 2007·Granted Mar 25, 2008·0 cites·1 claims
- 1853US10242942B2Integrated circuit package substrateMANUSHAROW MATHEW J·Filed 2014·Granted Mar 26, 2019·0 cites·17 claims
- 1953US7656644B2iTFC with optimized C(T)INTEL CORP·Filed 2008·Granted Feb 2, 2010·0 cites·21 claims
- 2053US7243423B2Chip package with degassing holesINTEL CORP·Filed 2004·Granted Jul 17, 2007·3 cites·7 claims
- 2151US7339263B2Integrated circuit packages, systems, and methodsINTEL CORP·Filed 2004·Granted Mar 4, 2008·4 cites·19 claims
- 2250US7265995B2Array capacitors with voids to enable a full-grid socketINTEL CORP·Filed 2003·Granted Sep 4, 2007·4 cites·16 claims
- 2350US7186645B2Selective plating of package terminalsINTEL CORP·Filed 2003·Granted Mar 6, 2007·2 cites·16 claims
- 2449US7524754B2Interconnect shunt used for current distribution and reliability redundancyINTEL CORP·Filed 2005·Granted Apr 28, 2009·0 cites·12 claims
- 2549US6867491B2Metal core integrated circuit package with electrically isolated regions and associated methodsINTEL CORP·Filed 2001·Granted Mar 15, 2005·3 cites·4 claims
- 2645US7495336B2Array capacitors for broadband decoupling applicationsINTEL CORP·Filed 2005·Granted Feb 24, 2009·0 cites·24 claims
- 2742US7365428B2Array capacitor with resistive structureINTEL CORP·Filed 2004·Granted Apr 29, 2008·0 cites·22 claims
- 2842US7208830B2Interconnect shunt used for current distribution and reliability redundancyINTEL CORP·Filed 2004·Granted Apr 24, 2007·0 cites·15 claims
- 2942US7152313B2Package substrate for integrated circuit and method of making the substrateINTEL CORP·Filed 2003·Granted Dec 26, 2006·2 cites·8 claims
- 3041US2006256531A1Thermal solution with isolation layerINTEL CORP·Filed 2005·Application pending·0 cites
- 3139US2004100780A1Motherboard power-levelerFiled 2002·Application pending·0 cites
- 3236US2004107569A1Metal core substrate packagingFiled 2002·Application pending·0 cites
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