Inventor · disambiguated record
Gernot Moik
Also filed as: MOIK GERNOT
2 granted patents·46 citations·filing 1999–2000
66Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0174US6309965B1Method of producing a semiconductor body with metallization on the back side that includes a titanium nitride layer to reduce warpingSIEMENS AG·Filed 2000·Granted Oct 30, 2001·25 cites·5 claims
- 0255US6147403ASemiconductor body with metallizing on the back sideINFINEON TECHNOLOGIES AG·Filed 1999·Granted Nov 14, 2000·21 cites·10 claims
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