Inventor · disambiguated record
Betty Hill-Shan Yeung
Also filed as: YEUNG BETTY H · YEUNG BETTY HILL-SHAN
8 granted patents·1 pending application·17 citations·filing 2006–2022
79Inventor score
Top patents by PatentIndex Score
9 records- 0192US11557525B2Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elementsNXP USA INC·Filed 2021·Granted Jan 17, 2023·3 cites·11 claims
- 0283US7989951B2Die assembliesFREESCALE SEMICONDUCTOR INC·Filed 2010·Granted Aug 2, 2011·7 cites·20 claims
- 0375US7950144B2Method for controlling warpage in redistributed chip packaging panelsFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted May 31, 2011·7 cites·19 claims
- 0470US11935809B2Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elementsNXP USA INC·Filed 2022·Granted Mar 19, 2024·0 cites·20 claims
- 0555US11817366B2Semiconductor device package having thermal dissipation feature and method thereforNXP USA INC·Filed 2020·Granted Nov 14, 2023·0 cites·20 claims
- 0649US12406896B2Semiconductor device package having thermal dissipation feature and method thereforNXP USA INC·Filed 2021·Granted Sep 2, 2025·0 cites·15 claims
- 0747US11121467B2Semiconductor package with compact antenna formed using three-dimensional additive manufacturing processNXP USA INC·Filed 2019·Granted Sep 14, 2021·0 cites·16 claims
- 0844US2007175660A1Warpage-reducing packaging designYEUNG BETTY H·Filed 2006·Application pending·0 cites
- 0942US9054111B2Electronic device and method of packaging an electronic deviceXU JIANWEN·Filed 2009·Granted Jun 9, 2015·0 cites·25 claims
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