Inventor · disambiguated record
Harry Hollack
Also filed as: HOLLACK HARRY
3 granted patents·487 citations·filing 1997–2001
81Inventor score
Technology areasG06F
Files withFLIP CHIP TECHNOLOGIES L L C3
Top patents by PatentIndex Score
3 records- 0193US6287893B1Method for forming chip scale packageFLIP CHIP TECHNOLOGIES L L C·Filed 1998·Granted Sep 11, 2001·241 cites·2 claims
- 0291US6441487B2Chip scale package using large ductile solder ballsFLIP CHIP TECHNOLOGIES L L C·Filed 1997·Granted Aug 27, 2002·182 cites·19 claims
- 0389US6750135B2Method for forming chip scale packageFLIP CHIP TECHNOLOGIES L L C·Filed 2001·Granted Jun 15, 2004·64 cites·13 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →