Inventor · disambiguated record
Motohide Takeichi
Also filed as: TAKEICHI MOTOHIDE
16 granted patents·2 pending applications·639 citations·filing 1995–2012
95Inventor score
Top patents by PatentIndex Score
18 records- 0196US5712610AProtective deviceSONY CHEMICALS CORP·Filed 1995·Granted Jan 27, 1998·151 cites·15 claims
- 0294US6531026B1Method for mounting electronic elementsSONY CHEMICALS CORP·Filed 2000·Granted Mar 11, 2003·100 cites·17 claims
- 0392US5965064AAnisotropically electroconductive adhesive and adhesive filmSONY CHEMICALS CORP·Filed 1998·Granted Oct 12, 1999·131 cites·13 claims
- 0483US6451875B1Connecting material for anisotropically electroconductive connectionSONY CHEMICALS CORP·Filed 2000·Granted Sep 17, 2002·32 cites·9 claims
- 0581US6903463B1COG-assembly and connecting material to be used thereinSONY CHEMICALS CORP·Filed 2000·Granted Jun 7, 2005·19 cites·11 claims
- 0678US6641928B2Adhesives and electric devicesSONY CHEMICALS CORP·Filed 2001·Granted Nov 4, 2003·27 cites·11 claims
- 0775US6020059AMultilayer anisotropic electroconductive adhesive and method for manufacturing sameSONY CHEMICALS CORP·Filed 1998·Granted Feb 1, 2000·48 cites·3 claims
- 0874US6566422B1Connecting materialSONY CHEMICALS CORP·Filed 2000·Granted May 20, 2003·22 cites·9 claims
- 0974US5939217ABattery and protecting element thereforSONY CHEMICALS CORP·Filed 1997·Granted Aug 17, 1999·53 cites·9 claims
- 1071US6514433B1Connecting materialSONY CHEMICALS CORP·Filed 2000·Granted Feb 4, 2003·13 cites·6 claims
- 1170US6426021B2Anisotropically electroconductive adhesive material and connecting methodSONY CHEMICALS CORP·Filed 2001·Granted Jul 30, 2002·17 cites·5 claims
- 1266US6673858B2Thermosetting adhesive materialSONY CHEMICALS CORP·Filed 2000·Granted Jan 6, 2004·8 cites·7 claims
- 1358US6349872B1Packaging methodSONY CHEMICALS CORP·Filed 2000·Granted Feb 26, 2002·9 cites·6 claims
- 1453US6632320B1Adhesive material and circuit connection methodSONY CHEMICALS CORP·Filed 2000·Granted Oct 14, 2003·5 cites·3 claims
- 1550US6611065B2Connection materialSONY CHEMICALS CORP·Filed 2001·Granted Aug 26, 2003·3 cites·10 claims
- 1643US6475641B2Connecting material and connection structureSONY CHEMICALS CORP·Filed 2001·Granted Nov 5, 2002·1 cites·15 claims
- 1739US2004029992A1Adhesive material and circuit connection methodSONY CHEMICALS CORP·Filed 2003·Application pending·0 cites
- 1834US2013154095A1Semiconductor devices connected by anisotropic conductive film comprising conductive microspheresYU ARUM·Filed 2012·Application pending·0 cites
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