Inventor · disambiguated record
Manabu Hirasawa
Also filed as: HIRASAWA MANABU
2 granted patents·1 pending application·0 citations·filing 2003–2020
23Inventor score
Technology areasH10P
Top patents by PatentIndex Score
3 records- 0142US12488979B2Lamination wafers and method of producing bonded wafers using the sameGLOBALWAFERS JAPAN CO LTD·Filed 2020·Granted Dec 2, 2025·0 cites·3 claims
- 0241US2008166891A1Heat treatment method for silicon waferCOVALENT MATERIALS CORP·Filed 2007·Application pending·0 cites
- 0330US7226513B2Silicon wafer cleaning methodTOSHIBA CERAMICS CO·Filed 2003·Granted Jun 5, 2007·0 cites·5 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →