Inventor · disambiguated record
Ai D. Le
Also filed as: LE AI D
9 granted patents·2 pending applications·233 citations·filing 2000–2003
90Inventor score
Files withHIGH CONNECTION DENSITY INC9
Top patents by PatentIndex Score
11 records- 0193US6312266B1Carrier for land grid array connectorsHIGH CONNECTION DENSITY INC·Filed 2000·Granted Nov 6, 2001·51 cites·28 claims
- 0289US6663399B2Surface mount attachable land grid array connector and method of forming sameHIGH CONNECTION DENSITY INC·Filed 2002·Granted Dec 16, 2003·49 cites·2 claims
- 0389US6471525B1Shielded carrier for land grid array connectors and a process for fabricating sameHIGH CONNECTION DENSITY INC·Filed 2001·Granted Oct 29, 2002·39 cites·17 claims
- 0481US6381164B1Low profile, high density memory systemHIGH CONNECTION DENSITY INC·Filed 2001·Granted Apr 30, 2002·33 cites·54 claims
- 0573US6638077B1Shielded carrier with components for land grid array connectorsHIGH CONNECTION DENSITY INC·Filed 2001·Granted Oct 28, 2003·18 cites·21 claims
- 0670US6723927B1High-reliability interposer for low cost and high reliability applicationsHIGH CONNECTION DENSITY INC·Filed 2001·Granted Apr 20, 2004·15 cites·15 claims
- 0769US6370770B1Carrier for land grid array connectorsHIGH CONNECTION DENSITY INC·Filed 2001·Granted Apr 16, 2002·15 cites·21 claims
- 0864US6590159B2Compact stacked electronic packageHIGH CONNECTION DENSITY INC·Filed 2001·Granted Jul 8, 2003·11 cites·42 claims
- 0952US6546625B1Method of forming a contact member cableHIGH CONNECTION DENSITY INC·Filed 2001·Granted Apr 15, 2003·2 cites·76 claims
- 1039US2003146017A1A Method of Forming A HiGH RELIABILITY INTERPOSER FOR LOW COST HIGH RELIABILITY APPLICATIONSFiled 2003·Application pending·0 cites
- 1137US2002098721A1Shielded carrier for land grid array connectors and a process for fabricating sameFiled 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →