Inventor · disambiguated record
Ming Yeung Luke Wan
Also filed as: WAN MING YEUNG · WAN MING YEUNG LUKE
5 granted patents·58 citations·filing 2001–2020
75Inventor score
Files withASM ASSEMBLY AUTOMATION LTD2ASM TECH SINGAPORE PTE LTD1ASMPT SINGAPORE PTE LTD1WAN MING YEUNG LUKE1
Top patents by PatentIndex Score
5 records- 0184US6616031B2Apparatus and method for bond force controlASM ASSEMBLY AUTOMATION LTD·Filed 2001·Granted Sep 9, 2003·47 cites·19 claims
- 0280US7727800B2High precision die bonding apparatusASM ASSEMBLY AUTOMATION LTD·Filed 2005·Granted Jun 1, 2010·9 cites·10 claims
- 0350US10199350B2Apparatus for heating a substrate during die bondingWAN MING YEUNG LUKE·Filed 2012·Granted Feb 5, 2019·2 cites·14 claims
- 0447US11552031B2High precision bonding apparatus comprising heaterASMPT SINGAPORE PTE LTD·Filed 2020·Granted Jan 10, 2023·0 cites·18 claims
- 0540US11121113B2Bonding apparatus incorporating variable force distributionASM TECH SINGAPORE PTE LTD·Filed 2020·Granted Sep 14, 2021·0 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →