Inventor · disambiguated record
King Lien Tai
Also filed as: TAI KING L · TAI KING LIEN
48 granted patents·5 pending applications·3,403 citations·filing 1982–2009
99Inventor score
Files withLUCENT TECHNOLOGIES INC18AT & T BELL LAB8AGERE SYST GUARDIAN CORP6AGERE SYSTEMS INC5AMERICAN TELEPHONE & TELEGRAPH4
Top patents by PatentIndex Score
53 records- 0198US5608262APackaging multi-chip modules without wire-bond interconnectionLUCENT TECHNOLOGIES INC·Filed 1995·Granted Mar 4, 1997·449 cites·15 claims
- 0298US4670770AIntegrated circuit chip-and-substrate assemblyAMERICAN TELEPHONE & TELEGRAPH·Filed 1984·Granted Jun 2, 1987·210 cites·18 claims
- 0396US6678167B1High performance multi-chip IC packageAGERE SYSTEMS INC·Filed 2000·Granted Jan 13, 2004·109 cites·10 claims
- 0496US6437990B1Multi-chip ball grid array IC packagesAGERE SYST GUARDIAN CORP·Filed 2000·Granted Aug 20, 2002·110 cites·7 claims
- 0596US6433411B1Packaging micromechanical devicesAGERE SYST GUARDIAN CORP·Filed 2000·Granted Aug 13, 2002·113 cites·16 claims
- 0696US5534465AMethod for making multichip circuits using active semiconductor substratesAT & T CORP·Filed 1995·Granted Jul 9, 1996·231 cites·5 claims
- 0794US5869894ARF IC packageLUCENT TECHNOLOGIES INC·Filed 1997·Granted Feb 9, 1999·180 cites·7 claims
- 0893US6396711B1Interconnecting micromechanical devicesAGERE SYST GUARDIAN CORP·Filed 2000·Granted May 28, 2002·115 cites·12 claims
- 0993US6013877ASolder bonding printed circuit boardsLUCENT TECHNOLOGIES INC·Filed 1998·Granted Jan 11, 2000·124 cites·15 claims
- 1093US5481205ATemporary connections for fast electrical access to electronic devicesAT & T CORP·Filed 1994·Granted Jan 2, 1996·98 cites·28 claims
- 1193US4496448AMethod for fabricating devices with DC bias-controlled reactive ion etchingAT & T BELL LAB·Filed 1983·Granted Jan 29, 1985·42 cites·13 claims
- 1290US6175158B1Interposer for recessed flip-chip packageLUCENT TECHNOLOGIES INC·Filed 1998·Granted Jan 16, 2001·115 cites·19 claims
- 1389US5197654ABonding method using solder composed of multiple alternating gold and tin layersKATZ AVISHAY·Filed 1991·Granted Mar 30, 1993·81 cites·14 claims
- 1488US6075691AThin film capacitors and process for making themLUCENT TECHNOLOGIES INC·Filed 1997·Granted Jun 13, 2000·110 cites·8 claims
- 1588US5234149ADebondable metallic bonding methodAT & T BELL LAB·Filed 1992·Granted Aug 10, 1993·109 cites·20 claims
- 1683US6465336B2Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip moduleAGERE SYST GUARDIAN CORP·Filed 2001·Granted Oct 15, 2002·29 cites·16 claims
- 1783US5747982AMulti-chip modules with isolated coupling between modulesLUCENT TECHNOLOGIES INC·Filed 1996·Granted May 5, 1998·79 cites·11 claims
- 1883US5234153APermanent metallic bonding methodAT & T BELL LAB·Filed 1992·Granted Aug 10, 1993·89 cites·20 claims
- 1983US5043794AIntegrated circuit package and compact assemblies thereofAT & T BELL LAB·Filed 1990·Granted Aug 27, 1991·79 cites·7 claims
- 2082US7259077B2Integrated passive devicesSYCHIP INC·Filed 2004·Granted Aug 21, 2007·23 cites·12 claims
- 2181US6075427AMCM with high Q overlapping resonatorLUCENT TECHNOLOGIES INC·Filed 1998·Granted Jun 13, 2000·70 cites·19 claims
- 2281US5990564AFlip chip packaging of memory chipsLUCENT TECHNOLOGIES INC·Filed 1997·Granted Nov 23, 1999·61 cites·16 claims
- 2381US5461333AMulti-chip modules having chip-to-chip interconnections with reduced signal voltage level and swingAT & T CORP·Filed 1994·Granted Oct 24, 1995·75 cites·13 claims
- 2480US6100475ASolder bonding printed circuit boardsLUCENT TECHNOLOGIES INC·Filed 1998·Granted Aug 8, 2000·51 cites·13 claims
- 2579US5936831AThin film tantalum oxide capacitors and resulting productLUCENT TECHNOLOGIES INC·Filed 1997·Granted Aug 10, 1999·57 cites·8 claims
- 2679US5564617AMethod and apparatus for assembling multichip modulesLUCENT TECHNOLOGIES INC·Filed 1995·Granted Oct 15, 1996·51 cites·19 claims
- 2778US6680212B2Method of testing and constructing monolithic multi-chip modulesLUCENT TECHNOLOGIES INC·Filed 2001·Granted Jan 20, 2004·24 cites·14 claims
- 2878US4946236AMovable fiber optical switchAT & T BELL LAB·Filed 1989·Granted Aug 7, 1990·38 cites·34 claims
- 2977US5834160AMethod and apparatus for forming fine patterns on printed circuit boardLUCENT TECHNOLOGIES INC·Filed 1996·Granted Nov 10, 1998·44 cites·3 claims
- 3076US6369444B1Packaging silicon on silicon multichip modulesAGERE SYST GUARDIAN CORP·Filed 1998·Granted Apr 9, 2002·47 cites·12 claims
- 3175US6160715ATranslator for recessed flip-chip packageLUCENT TECHNOLOGIES INC·Filed 1998·Granted Dec 12, 2000·39 cites·18 claims
- 3274US6077725AMethod for assembling multichip modulesLUCENT TECHNOLOGIES INC·Filed 1992·Granted Jun 20, 2000·42 cites·23 claims
- 3374US4995695AOptical assembly comprising optical fiber coupling meansAT & T BELL LAB·Filed 1989·Granted Feb 26, 1991·35 cites·16 claims
- 3471US5699105ACurbside circuitry for interactive communication servicesLUCENT TECHNOLOGIES INC·Filed 1995·Granted Dec 16, 1997·40 cites·14 claims
- 3569US6281590B1Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip moduleAGERE SYST GUARDIAN CORP·Filed 1997·Granted Aug 28, 2001·31 cites·9 claims
- 3663US6251705B1Low profile integrated circuit packagesAGERE SYSTEMS INC·Filed 1999·Granted Jun 26, 2001·27 cites·12 claims
- 3760US6029224ASelf-contained memory apparatus having diverse types of memory and distributed controlLUCENT TECHNOLOGIES INC·Filed 1995·Granted Feb 22, 2000·43 cites·20 claims
- 3858US5622305ABonding scheme using group VB metallic layerLUCENT TECHNOLOGIES INC·Filed 1995·Granted Apr 22, 1997·27 cites·21 claims
- 3957US5000532AOptical fiber switchAT & T BELL LAB·Filed 1989·Granted Mar 19, 1991·18 cites·1 claims
- 4055US6683384B1Air isolated crossoversAGERE SYSTEMS INC·Filed 1997·Granted Jan 27, 2004·20 cites·10 claims
- 4155US4896937AOptical fiber switchAMERICAN TELEPHONE & TELEGRAPH·Filed 1988·Granted Jan 30, 1990·17 cites·17 claims
- 4255US4767695ANonplanar lithography and devices formed therebyAMERICAN TELEPHONE & TELEGRAPH·Filed 1987·Granted Aug 30, 1988·13 cites·7 claims
- 4355US4703288AInterconnection lines for wafer-scale-integrated assembliesAMERICAN TELEPHONE & TELEGRAPH·Filed 1985·Granted Oct 27, 1987·20 cites·10 claims
- 4453US4454221AAnisotropic wet etching of chalcogenide glass resistsAT & T BELL LAB·Filed 1982·Granted Jun 12, 1984·18 cites·29 claims
- 4550US2009218655A1Integrated passive devicesDEGANI YINON·Filed 2009·Application pending·0 cites
- 4647US2007262418A1Integrated passive devicesDEGANI YINON·Filed 2007·Application pending·0 cites
- 4743US2006197182A1High frequency integrated circuitsDEGANI YINON·Filed 2006·Application pending·0 cites
- 4839US7061258B2Testing integrated circuitsSYCHIP INC·Filed 2004·Granted Jun 13, 2006·0 cites·10 claims
- 4937US6867607B2Membrane test method and apparatus for integrated circuit testingSYCHIP INC·Filed 2002·Granted Mar 15, 2005·0 cites·4 claims
- 5037US2004075170A1High frequency integrated circuitsFiled 2002·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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